Ground-Plane Socket Connector for High-Speed Signal Integrity
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Solution Overview
Problem
Conventional electrical interconnects fail to meet the increasing demands for higher data rates in communication systems due to limitations in electrical performance.
Innovation Solution
A socket connector design featuring a substrate with a ground plane and deflectable mating elements, where the ground plane electrically connects socket contacts to enhance electrical performance by increasing resonant frequencies beyond 60 GHz, improving insertion loss, return loss, near-end crosstalk, and far-end crosstalk.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional electrical interconnects are used, then the structure is simple and ease of manufacture is maintained, but electrical performance deteriorates at higher data rates
Solution Approach 1:
The connector is divided into an upper housing and a lower housing that can be separately manufactured and then assembled together. The substrate is segmented into multiple layers including signal layers and ground layers, allowing for optimized electrical performance in each segment while maintaining overall system reliability
Solution Approach 2:
The substrate with its multi-layer structure (signal layers nested within ground layers) is embedded within the housing structure. The socket contacts are nested within the substrate, creating a compact nested arrangement that achieves complex electrical performance requirements without proportionally increasing external dimensions
2Reliability
If dual compression socket connectors are used, then repeated mating and unmating is enabled, but electrical performance is insufficient for high data rates
Solution Approach 1:
The design changes the electrical parameters by implementing controlled impedance signal paths through the substrate, optimizing the characteristic impedance to match high-speed signal requirements. The ground plane configuration and signal trace geometry are specifically designed to maintain consistent impedance across the mating interface, enabling reliable high-data-rate transmission
Solution Approach 2:
The substrate acts as an intermediary between the upper and lower housings, providing a controlled impedance path for signals. The ground planes serve as intermediary reference potentials that stabilize the electrical characteristics during mating and unmating operations, ensuring consistent electrical performance
3Speed
If conventional interconnects are used, then device complexity is low, but resonant frequencies are limited below 60 GHz
Solution Approach 1:
The design transitions from a two-dimensional surface contact to a three-dimensional multi-layer substrate structure. By adding the vertical dimension with multiple signal and ground layers, the connector achieves higher resonant frequencies and better electrical performance while maintaining a compact form factor suitable for high-speed applications
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The socket connector with a ground plane significantly enhances electrical performance by increasing resonant frequencies, allowing reliable operation at higher data rates compared to conventional connectors.
Implementation Method 1
The ground plane electrically connects the socket contacts and increases resonant frequencies beyond 60 GHz
Implementation Method 2
The upper mating element is deflectable relative to the contact body and extends to the upper surface to interface with a first electrical component. The lower mating element is deflectable relative to the contact body and extends to the lower surface to interface with a second electrical component.
Data Source
AI summary
A socket connector includes a substrate having an upper surface and a lower surface. The substrate has a ground plane between the upper surface and the lower surface. The substrate includes contact channels between the upper and lower surfaces. The socket connector includes socket contacts received in corresponding contact channels. Each socket contact includes a contact body, an upper mating element, and a lower mating element. The upper mating element is deflectable relative to the contact body and extends to the upper surface to interface with a first electrical component. The lower mating element is deflectable relative to the contact body and extends to the lower surface to interface with a second electrical component. A plurality of the socket contacts are electrically connected to the ground plane.