Ground Reinforcement Structure for Electronic Device Noise Suppression
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Solution Overview
Problem
The existing ground reinforcement structures in electronic devices fail to adequately secure the ground, leading to deterioration in Radiated Emission (RE) performance due to noise generation from electromagnetic waves.
Innovation Solution
A ground reinforcement structure is constructed on a circuit board with a socket, incorporating a first and second ground path on the second circuit board, electrically coupled to the first circuit board and metal structures, respectively, to suppress noise generation and improve RE performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a connector is used to electrically couple the auxiliary circuit board to the main circuit board, then the device structure is simplified and assembly is easier, but noise is generated due to insufficient ground securing, deteriorating RE performance
Solution Approach 1:
The ground path is divided into multiple segments: a first ground path on the auxiliary circuit board, a connector ground terminal, and a second ground path on the main circuit board. These segments are electrically connected in sequence to form a complete ground path, allowing the ground connection to be distributed across multiple components rather than requiring a single direct connection.
Solution Approach 2:
The connector ground terminal serves as an intermediary element between the auxiliary circuit board ground path and the main circuit board ground path. This intermediary provides a dedicated ground connection point that bridges the two circuit boards through the connector structure, ensuring proper ground potential reference.
2Object-affected harmful factors
If the ground path is extended across multiple circuit boards through a connector, then RE performance is improved by reducing noise, but the ground path resistance and inductance increase
Solution Approach 1:
The ground path design optimizes local characteristics at each segment. The auxiliary circuit board ground path is configured with appropriate width and routing to minimize local impedance. The connector ground terminal is designed with sufficient contact area and conductive material to provide low-impedance connection. The main circuit board ground path is connected to a large ground area to minimize ground inductance and resistance at the termination point.
Solution Approach 2:
The ground connection is established not only through the vertical connection at the connector but also through the horizontal ground paths on each circuit board. This multi-dimensional ground path configuration provides redundant ground routes and reduces the overall impedance by distributing the ground current across multiple pathways in different spatial dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The implementation of the ground reinforcement structure enhances RE performance by approximately 9 dBm due to the first ground path and 7.2 dBm due to the second ground path, effectively reducing noise generation and securing reliable RE performance.
Implementation Method 1
at least one or more metal structures disposed on the first circuit board to transfer, to another component, heat of at least one or more exothermic elements mounted on the first circuit board
Implementation Method 2
a ground path constructed in at least part of the second circuit board so as to be electrically coupled to the first circuit board or the metal member or the first circuit board and the metal structure
Data Source
AI summary
An electronic device according to various embodiments of the disclosure may include: a housing which includes a first plate facing a first direction, a second plate facing a second direction opposite to the first direction, and a lateral member covering at least part of the space between the first and second plates; a display disposed to be visible in at least part of the first plate; a first circuit board which includes a first face facing the first direction and a second face facing the second direction, and which is disposed in the second direction of the display; a second circuit board which is disposed not to overlap at least in part with the first printed circuit board, and which is electrically coupled with the first circuit board; a socket mounted to the second circuit board; at least one or more metal structures disposed on the first circuit board to transfer, to another component, heat of at least one or more exothermic elements mounted on the first circuit board; and a ground path constructed in at least part of the second circuit board so as to be electrically coupled to the first circuit board or the metal member or the first circuit board and the metal structure.