Ground Terminal Connector Layout to Prevent Solder Interference
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Solution Overview
Problem
Existing connectors, such as those described in Japanese Unexamined Patent Application Publication No. 2006-331679, face challenges in achieving a low profile configuration while maintaining effective soldering and preventing solder interference with metal surfaces.
Innovation Solution
The connector design includes a resin body member with exposed side and bottom metal films on the ground terminal, where the regions between the ends of the side and bottom metal films are offset, reducing overlap and increasing the distance between these surfaces, thereby minimizing solder interference and allowing for a low-profile configuration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the connector is configured with a low profile, then the height is reduced, but solder may interfere with the contact between ground terminals and metal films
Solution Approach 1:
The patent applies dimensional offset in the X-axis direction to separate the side metal film and bottom metal film regions. By ensuring that the region between both ends of the side metal film in the X-axis direction does not overlap with the region between both ends of the bottom metal film in the X-axis direction, the design creates spatial separation that prevents solder from simultaneously contacting both metal films, thus maintaining reliable soldering contact in a low-profile configuration.
Solution Approach 2:
The patent implements local quality by providing different metal film configurations at different locations of the ground terminal. The side metal film covers part of the side surface while the bottom metal film covers part of the bottom surface, with their X-axis regions deliberately offset. This localized differentiation ensures that solder contacts only the intended metal film surface, preventing interference while maintaining effective electrical connection.
2Ease of manufacture
If the side metal film and bottom metal film regions overlap in the X-axis direction, then soldering is easier, but solder interferes with the contact between ground terminals and metal films
Solution Approach 1:
The patent resolves the contradiction by utilizing the X-axis dimension to create non-overlapping regions between the side metal film and bottom metal film. This dimensional separation strategy allows solder to easily contact the exposed metal film surfaces without causing interference, as the offset configuration ensures solder applied to one metal film cannot reach the other metal film region.
3Volume of moving object
If the connector height is reduced for low profile, then the overall size is smaller, but the distance between metal films decreases increasing solder interference risk
Solution Approach 1:
The patent compensates for the reduced Z-axis height by implementing X-axis offset between the side metal film and bottom metal film regions. This dimensional redistribution maintains adequate separation distance between metal films even in a compact low-profile configuration, preventing solder from bridging between the two metal film surfaces while preserving the reduced overall volume.
Data Source
AI summary
A ground terminal includes a side portion having a side surface facing in a negative direction of a Y-axis, the side surface being exposed from a resin body member, a bottom portion having a bottom surface facing in a positive direction of a Z-axis, the bottom surface being exposed from the resin body member, a side metal film covering part of the side surface, and a bottom metal film covering part of the bottom surface. A region between both ends of the side metal film in an X-axis direction does not overlap, on an X-axis, a region between both ends of the bottom metal film in the X-axis direction. The side surface and the bottom surface are connected.