Ground Vias Suppress Surface Waves in PCB Phased-Array Antennas
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Solution Overview
Problem
Conventional techniques for suppressing surface waves in phased-array antennas, such as using dummy elements and magnetic microwave absorbers, are costly and unsuitable for low-cost, high-volume consumer electronics, as they require additional materials and manufacturing costs.
Innovation Solution
The implementation of a phased-array antenna design that includes a series of ground vias formed through the printed circuit board, connecting each via to a ground plane and radiating elements, to suppress surface wave propagation without the need for additional materials or high-cost components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If dummy elements and magnetic microwave absorber materials are used to suppress surface waves, then surface wave propagation is attenuated, but manufacturing cost and material cost increase significantly
Solution Approach 1:
The patent replaces expensive magnetic microwave absorber materials with inexpensive via structures that can be easily manufactured using standard PCB processes. The via structures act as surface wave suppressors without requiring additional costly materials, thereby reducing manufacturing cost while maintaining effectiveness against surface wave propagation.
Solution Approach 2:
The patent extracts the essential function of surface wave suppression from the complex combination of dummy elements and magnetic absorber materials, reducing it to simple via structures. This extraction eliminates the need for expensive materials while retaining the core functionality of attenuating surface waves.
2Object-affected harmful factors
If dummy elements and magnetic microwave absorber materials are used to suppress surface waves, then surface wave propagation is attenuated, but device complexity increases
Solution Approach 1:
The patent replaces complex magnetic microwave absorber materials and dummy element structures with simple via structures that are already part of the standard PCB manufacturing process. This simplification reduces device complexity while maintaining surface wave suppression effectiveness.
Solution Approach 2:
The via structures serve multiple functions: they provide electrical grounding and simultaneously act as surface wave suppressors. This multi-functionality eliminates the need for separate dummy elements and absorber materials, thereby reducing overall device complexity.
3Object-affected harmful factors
If dummy elements and magnetic microwave absorber materials are used to suppress surface waves, then surface wave propagation is attenuated, but additional materials and components are required
Solution Approach 1:
The via structures perform dual functions as both electrical ground connections and surface wave suppressors. This eliminates the need for additional magnetic microwave absorber materials and dummy elements, thereby reducing the quantity of additional materials required while maintaining effective surface wave attenuation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces surface wave amplitude, maintaining antenna performance and scan capabilities while reducing manufacturing and material costs, offering a cost-effective alternative to conventional methods.
Implementation Method 1
A series of ground vias extend between the top and bottom ends of the stacked printed circuit board. The ground vias are configured to suppress surface waves propagating across the stacked printed circuit board.
Data Source
AI summary
A phased-array antenna includes an antenna layer of a stacked printed circuit board, a ground plane layer of the stacked printed circuit board spaced apart from the antenna layer, and a first dielectric layer of the stacked printed circuit board disposed between and in opposed contact with the antenna layer and the ground plane layer. The antenna layer includes an associated metal patch pattern defined by a series of slots. The stacked printed circuit board defines a thickness extending between a top end of the stacked printed circuit board and a bottom end of the stacked printed circuit board. The phased-array antenna includes a series of ground vias extending between the top and bottom ends of the stacked printed circuit board. The ground vias are configured to suppress surface waves propagating across the stacked printed circuit board.