Grounded Chuck with Conductive Pin Assemblies
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Solution Overview
Problem
Existing methods for reducing static charge buildup in semiconductor wafer processing equipment, particularly in components made of non-conductive materials, are inadequate, leading to potential contamination and damage from electrostatic discharge.
Innovation Solution
Incorporating electrically conductive pathways through pin assemblies and chuck components, using conductive materials like static dissipative plastics and metals to ground the wafer-supporting chuck, ensuring that the wafer and equipment are electrically connected and can dissipate static charge.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If non-conductive materials (PVDF, PEEK, PTFE) are used for chuck components, then chemical resistance and cleanliness are improved, but static charge buildup increases
Solution Approach 1:
The patent applies composite materials by combining non-conductive materials (PVDF, PEEK, or PTFE) with conductive elements (metal liners, metal pins, or conductive coatings). This creates a composite structure where the non-conductive portion provides chemical resistance and cleanliness while the conductive portion dissipates static charge, thereby resolving the contradiction between chemical resistance and static charge prevention.
2Adaptability or versatility
If non-conductive processing fluids (deionized water, 2-propanol) are used, then process compatibility is improved, but static charge buildup increases
Solution Approach 1:
The patent introduces conductive intermediaries (metal liners, metal pins, conductive coatings) within the chuck structure as mediators between the non-conductive processing fluids and the chuck body. These intermediaries provide a conductive pathway for static charge dissipation while allowing the processing fluids to maintain their non-conductive properties for process compatibility, thus resolving the contradiction.
3Object-generated harmful factors
If conductive materials (metal shafts, resin pins) are used in chucks, then static charge dissipation is improved, but contamination risk increases
Solution Approach 1:
The patent applies local quality by making only specific portions of the chuck conductive (liners, pins, or coatings) rather than the entire chuck structure. The conductive elements are localized to where they are needed for static charge dissipation, while the majority of the chuck remains non-conductive to maintain chemical resistance and minimize contamination risk, thereby resolving the contradiction between static charge dissipation and contamination prevention.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively reduces or eliminates static charge buildup, preventing contamination and damage to integrated circuits by ensuring a grounded conductive pathway, applicable to various surface treatment processes beyond semiconductor wafers.
Implementation Method 1
providing an electrically conductive pathway through the chuck, and in particular through the pin assemblies which support a wafer during processing, such that the chuck and wafer will be grounded
Data Source
AI summary
Improved reduction of static charge in spin chucks is achieved by providing one or more pin assemblies which are formed from chemically inert material and which include an electrically conductive inlay.