Grounded Chuck Ring for Wafer Rinse-Dry Charge Dissipation
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Solution Overview
Problem
The challenge in semiconductor manufacturing is the efficient removal of polishing slurry and residues post-CMP process while preventing electrostatic charge accumulation, which leads to corrosion and defects on the wafer surface.
Innovation Solution
A rinsing and drying tool with a grounded conductive chuck ring and chuck pins that encircle the wafer periphery, providing a minimum discharge path for electrostatic charges during high-speed rotation, ensuring complete removal of residues and preventing charge build-up.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If high-speed rotation is used to remove polishing residues, then cleaning efficiency is improved, but electrostatic charge accumulation increases causing corrosion and defects
Solution Approach 1:
A conductive member is introduced as an intermediary between the semiconductor wafer and ground. This conductive member provides a controlled path for electrostatic charges to dissipate to ground, preventing charge accumulation on the wafer surface while allowing high-speed rotation for effective cleaning
Solution Approach 2:
The electrostatic charges generated during high-speed rotation are not simply eliminated but are converted into a beneficial discharge path through the conductive member. The charges that would normally cause corrosion and defects are instead directed to ground through the conductive member, transforming a harmful effect into a controlled process
2Object-affected harmful factors
If conventional cleaning methods are used, then electrostatic charge accumulation is reduced, but polishing residue removal is incomplete
Solution Approach 1:
The invention merges two functions into a single conductive member: (1) providing electrostatic discharge path to ground, and (2) supporting the wafer during high-speed rotation. This combination allows simultaneous achievement of charge dissipation and effective residue removal through centrifugal force
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces electrostatic charge accumulation and metal corrosion, enhancing the cleanliness and integrity of semiconductor wafers by ensuring rapid and complete removal of residues and charges, thereby improving yield and reducing defects.
Implementation Method 1
supporting the semiconductor wafer continuously along a periphery of the semiconductor wafer with an electrically grounded conductive member; and spinning the semiconductor wafer, wherein surface charges induced during spinning are dissipated by movement of electrons from the semiconductor wafer to the electrically grounded conductive member at the periphery of the semiconductor wafer
Implementation Method 2
A rinsing and drying tool with a grounded conductive chuck ring and chuck pins that encircle the wafer periphery, providing a minimum discharge path for electrostatic charges during high-speed rotation, ensuring complete removal of residues and preventing charge build-up
Data Source
AI summary
Provided are a tool and a method for processing a semiconductor wafer. A semiconductor processing tool includes a conductive chuck ring; catch pins, wherein the semiconductor processing tool is configured for movement between an open configuration, in which top surfaces of the catch pins are distanced above an upper surface of the conductive chuck ring to receive a semiconductor wafer, and a closed configuration in which the top surfaces are not distanced above the upper surface to position the semiconductor wafer on the conductive chuck ring; an electrical ground connected to the conductive chuck ring; and a motor configured to spin the conductive chuck ring and the semiconductor wafer received thereon around an axis.