Grounded Conductive Substrate Handling Prevents Charging
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Solution Overview
Problem
In semiconductor device manufacturing, substrates are prone to electrical charging due to contact with resin materials in processing chambers, leading to electrical discharge and potential breakdown of surface films or devices during processing and transfer.
Innovation Solution
A substrate processing apparatus with conductive portions in the substrate holding and transfer mechanisms that are electrically grounded, ensuring the substrate remains grounded throughout handling and transfer, preventing electrical induction and discharge.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If resin materials (PTFE, PCTFE) are used for members in the processing chamber to provide chemical resistance, then chemical resistance is improved, but electrical charging of substrates occurs leading to electrical discharge and potential damage to substrate films or devices
Solution Approach 1:
A conductive member is introduced as an intermediary between the substrate and the resin member. The conductive member contacts the substrate and provides a grounding path, preventing electrical charging while allowing the resin member to maintain its chemical resistance function. This intermediary element resolves the contradiction by decoupling the electrical grounding function from the chemical resistance function.
Solution Approach 2:
The solution uses a composite structure combining conductive materials (such as metal or conductive coatings) with resin materials. The conductive portion provides electrical grounding to prevent substrate charging, while the resin portion maintains chemical resistance. This composite approach allows both functions to coexist without interference.
2Ease of operation
If substrates are transferred in the processing chamber surrounded by resin members, then substrate transfer is enabled, but substrates become electrically induced and charged causing potential breakdown of films or devices
Solution Approach 1:
A conductive member acts as an intermediary during substrate transfer operations. The conductive member maintains continuous electrical contact with the substrate throughout the transfer process, providing a grounding path that prevents electrical induction and charging. This allows substrate transfer to proceed without compromising film integrity.
Solution Approach 2:
The conductive member establishes electrical grounding with the substrate before potential electrical discharge can occur during transfer operations. By pre-establishing the grounding path, the system prevents electrical induction and charging that would otherwise damage substrate films or devices during the transfer process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively prevents substrate charging and discharge, protecting thin films and devices from damage during processing and transfer, ensuring high-quality substrate processing.
Implementation Method 1
at least the substrate contacting portion (82a, 82b) of the first substrate contacting member includes a conductive portion, which is electrically grounded
Implementation Method 2
a conductive portion, which is electrically grounded
Implementation Method 3
The members made of such resin material are readily electrically charged
Data Source
AI summary
A substrate processing apparatus includes: a carrier holding unit for holding a carrier which houses a substrate; a substrate holding mechanism for holding a substrate when a predetermined process is executed on the substrate; and a substrate transfer mechanism for transferring a substrate between the substrate holding mechanism and the carrier held by the carrier holding unit. The substrate holding mechanism has a first substrate contacting member which comes in contact with the substrate when the substrate holding mechanism holds the substrate, and at least the substrate contacting portion of the first substrate contacting member includes a conductive portion, which is electrically grounded. The substrate transfer mechanism has a second substrate contacting member which comes in contact with the substrate when the substrate transfer mechanism transfers the substrate, and at least the substrate contacting portion of the second substrate contacting member includes a conductive portion, which is electrically grounded.