Grounded Connector Alignment Structure for Reflow Misalignment

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Solution Overview

Problem

In connectors, misalignment between conductive members and alignment members due to different thermal expansion coefficients during the reflow process can cause malfunction, especially with narrow contact pitches and high-frequency applications, leading to poor signal transmission characteristics.

Innovation Solution

A connector design featuring a conductive member electrically connected to contact pins for grounding, coupled with an alignment member using protrusions and holes that accommodate each other, with specific configurations in center and end areas to minimize thermal misalignment, ensuring accurate positioning and noise absorption.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conductive member and alignment member are used in a connector, then good high frequency characteristics are achieved through noise absorption, but relative misalignment occurs between the conductive member and alignment member due to different thermal expansion coefficients during reflow process

Engineering Contradiction:
Improvehigh frequency characteristicsVSAvoidposition accuracy
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent changes the physical state and material properties by selecting specific materials for the conductive member and alignment member with matched thermal expansion coefficients. This parameter change ensures that both members expand at the same rate during the reflow process, preventing relative misalignment while maintaining the electrical grounding function for high frequency characteristics.

Inventive Principle:
Principle #35Parameter changes

2Strength

If the conductive member and alignment member are coupled at the end areas, then the coupling strength is increased, but the distance for thermal extension is longer causing greater misalignment

Engineering Contradiction:
Improvecoupling strengthVSAvoidposition accuracy
Core Design Contradiction:
StrengthVSManufacturing precision

Solution Approach 1:

The patent transitions from end-area coupling to center-area coupling, changing the spatial dimension of the coupling location. By positioning the coupling at the center of both members, the distance to the ends is minimized, reducing thermal extension displacement while maintaining adequate coupling strength through proper coupling mechanism design.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Reliability

If multiple protrusions and holes are provided for coupling, then the coupling reliability is improved, but the manufacturing complexity increases

Engineering Contradiction:
Improvecoupling reliabilityVSAvoidstructure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent divides the coupling function into multiple protrusions and holes distributed at different locations (center and end areas). This segmentation provides redundant coupling points, ensuring that even if one coupling point fails due to thermal stress, other points maintain the connection, thereby improving overall coupling reliability without excessive complexity.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively suppresses relative misalignment and ensures good high-frequency characteristics by maintaining position accuracy and preventing stress due to thermal expansion differences, enhancing the reliability of the connector in reflow processes.

Implementation Method 1

a conductive member formed extending in the longitudinal direction, coupled to the alignment member, and electrically connected to the contact pins used for grounding

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 2

When the conductive member and the alignment member have different thermal expansion coefficients, relative misalignment between the conductive member and the alignment member may occur

Methodology Applied
Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentEP4297198A1connector
Publication Date: 2023.12.27 YAMAICHI ELECTRONICS CO LTD
  • EP4297198A1 patent drawingFigure 1
  • EP4297198A1 patent drawingFigure 2
  • EP4297198A1 patent drawingFigure 3

AI summary

Provided is a connector including: a pin group having contact pins aligned in a predetermined direction; an alignment member formed extending in the predetermined direction and having an alignment groove at an end in a width direction orthogonal to the predetermined direction, the alignment groove being for aligning the contact pins; and a conductive member formed extending in the predetermined direction, coupled to the alignment member, and electrically connected to the contact pins used for grounding. The alignment member includes any one of a first protrusion and a first hole configured to accommodate the first protrusion in a center area in the predetermined direction, the conductive member includes the other of the first protrusion and the first hole in the center area in the predetermined direction, and the alignment member and the conductive member are coupled to each other by the first protrusion being secured in the first hole.