Grounded Cooling Member Structure for Heat and EMI Control
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Solution Overview
Problem
Current semiconductor devices face challenges in achieving both excellent heat dissipation capacity and electromagnetic wave suppression while being cost-effective and easy to produce, with existing solutions often requiring additional shielding members that increase production complexity and cost.
Innovation Solution
A semiconductor device design featuring a conductive thermally conductive member with a cured resin, connected to a ground substrate, which enhances heat dissipation and electromagnetic wave suppression without the need for a separate shielding member, allowing for flexibility and reduced production costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat dissipating component made of metal is placed near an electronic component, then heat dissipation capacity is improved, but electromagnetic wave suppression deteriorates because the metallic component acts as an antenna or transmission path for harmonic noise
Solution Approach 1:
The patent merges the heat dissipation function and electromagnetic shielding function into a single integrated component. The cooling member is designed with a conductive shielding member that is electrically connected to ground, allowing it to simultaneously conduct heat away from the semiconductor device and shield against electromagnetic waves by providing a grounded conductive path for electromagnetic interference.
Solution Approach 2:
The cooling member is given multiple functions: it serves as both a thermal management component (dissipating heat from the semiconductor device) and an electromagnetic shielding component (blocking electromagnetic waves through its conductive structure connected to ground). This multi-functionality eliminates the need for separate shielding components.
2Object-generated harmful factors
If a separate electromagnetic shielding member is provided to suppress electromagnetic waves, then electromagnetic wave suppression is improved, but device complexity and production cost increase
Solution Approach 1:
The patent combines the cooling member and electromagnetic shielding member into a single integrated structure. The cooling member includes a conductive shielding portion that is electrically connected to ground, eliminating the need for a separate shielding component and reducing assembly steps and production complexity.
Solution Approach 2:
The cooling member is designed to perform both cooling and electromagnetic shielding functions simultaneously. By making the cooling member itself conductive and grounding it, the patent eliminates the need for additional shielding components, thereby reducing device complexity and production costs.
3Ease of manufacture
If a conventional cooling member structure is used, then ease of manufacture is limited, but production cost and complexity increase when additional shielding members are added
Solution Approach 1:
The patent integrates the shielding function into the cooling member structure itself, eliminating the need for separate shielding components and their associated assembly steps. This integration simplifies the manufacturing process and reduces production complexity while maintaining both cooling and shielding functions.
Solution Approach 2:
The cooling member is designed as a multi-functional component that provides both thermal management and electromagnetic shielding. This approach reduces the total number of components and assembly operations, thereby improving ease of manufacture and reducing production complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution effectively achieves higher levels of heat dissipation and electromagnetic wave suppression, reducing production complexity and costs while maintaining device thinness and ease of production.
Implementation Method 1
heat exchange can be effectively performed between a semiconductor element and a conductive cooling member by forming a conductive thermally conductive member between the semiconductor element and the cooling member
Implementation Method 2
the conductive thermally conductive member is connected to a ground in the substrate to electrically connect the cooling member and the ground, so that an electrically closed space can be formed
Data Source
AI summary
Provided is a semiconductor device having excellent heat dissipation capacity and electromagnetic wave suppression effect. A semiconductor device 1 includes a semiconductor element 30; a conductive cooling member 40 provided above the semiconductor element 30, a conductive thermally conductive member 10 that is provided between the semiconductor element 30 and the cooling member 40 and contains a cured resin. The conductive thermally conductive member 10 is connected to a ground 60 in the substrate 50 to electrically connect the cooling member 40 and the ground 60.