Grounded Mold Interconnect EMI Shielding for BGA Packages
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Solution Overview
Problem
High electromagnetic interference (EMI) issues in small package electronic devices like ball grid array (BGA) and chip-scale packages are not effectively addressed by existing methods, which often require expensive materials and additional process steps.
Innovation Solution
The implementation of a multilevel package substrate with a metal shield and through mold vias (TMVs) that electrically couple the shield to a ground, providing a cost-effective solution for EMI reduction without the need for expensive lids or sputtered shielding materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a grounded lid or sputter shielding metal is used to address EMI problems, then EMI shielding effectiveness is improved, but manufacturing cost and process complexity increase
Solution Approach 1:
The patent combines the EMI shielding function with the existing package mold structure by integrating a metal shield layer into the molded package. The shield is formed as part of the package structure itself rather than as a separate component, merging multiple functions (structural support and EMI shielding) into a single integrated solution. This eliminates the need for separate grounded lids or additional sputtering process steps.
Solution Approach 2:
The metal shield layer serves multiple functions: it provides EMI shielding, acts as a ground reference plane, and integrates with the package molding structure. The shield is electrically connected to ground through the package substrate, creating a multi-functional element that addresses EMI problems while also serving as part of the overall package architecture.
2Power
If switching speed and power density are increased in small packages, then device performance is improved, but EMI problems worsen
Solution Approach 1:
The patent converts the high-power, high-speed operation that generates EMI into an opportunity to implement an effective shielding solution. The metal shield layer, integrated into the package structure, captures and redirects EMI energy to ground, transforming the harmful radiation into a controlled electrical signal that can be safely dissipated. The shield acts as a法拉第 cage, containing electromagnetic fields within the package structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces EMI radiation by 3 to 4 times while improving thermal performance and is less expensive to produce, using existing manufacturing equipment and materials.
Implementation Method 1
a conductive package via that extends through the molded package structure and electrically couples the metal shield to the second conductive pad
Implementation Method 2
forming a metal shield along a package side of the molded package structure, the metal shield contacting the conductive package via
Data Source
AI summary
An electronic device includes a multilevel package substrate, a semiconductor die, and a molded package structure, where the multilevel package substrate has opposite first and second substrate sides, first and second conductive pads spaced apart from one another along the first substrate side, and a conductive substrate terminal that is exposed along the second substrate side and is electrically coupled to the second conductive pad. The semiconductor die is attached to the first substrate side and has opposite first and second die sides, and a die terminal along the first die side, the die terminal electrically coupled to the first conductive pad. The molded has a package side, a metal shield along the package side, and a conductive package via that extends through the molded package structure and electrically couples the metal shield to the second conductive pad.