Grounded Heat-Dissipating Shield Structure for EMC Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing electronic control devices with exposed conductive bases fail to adequately suppress external electromagnetic radiation and noise due to their design.
Innovation Solution
An electronic control device with an enclosure structure that includes a first and second enclosure, a circuit board, an integrated circuit element, and a heat dissipating shield member thermally coupled to the integrated circuit element, where the heat dissipating shield member has an inner portion within the enclosure and an outer portion extending through communication openings to enhance cooling and noise suppression.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the conductive base is exposed from the housing to fix the print circuit board, then the ease of manufacture is improved, but the electromagnetic radiation and noise suppression deteriorates
Solution Approach 1:
The patent combines the heat dissipation function and electromagnetic shielding function into a single integrated component (the heat dissipation shield member). This member has a first portion that contacts the integrated circuit element for heat dissipation and a second portion that extends to the housing to provide electromagnetic shielding, thereby achieving both functions without requiring separate components and maintaining ease of manufacture.
Solution Approach 2:
The heat dissipation shield member serves multiple functions: it acts as a heat dissipation component by conducting heat from the integrated circuit element, and simultaneously serves as an electromagnetic shield by extending to the housing to block electromagnetic radiation and noise. This multi-functional design simplifies the overall structure while maintaining manufacturing simplicity.
2Productivity
If the operating frequency is increased to a GHz band to improve communication speed, then the productivity is improved, but the heat generation increases requiring greater cooling performance
Solution Approach 1:
The patent integrates the heat dissipation function directly into the shielding structure. The heat dissipation shield member is thermally coupled to the integrated circuit element and extends to the housing, creating an integrated thermal management system that efficiently conducts heat away from the high-frequency operating components without requiring separate cooling mechanisms.
3Productivity
If the communication speed is increased to suppress electromagnetic radiation intrusion, then the productivity is improved, but the heat generation increases requiring better cooling
Solution Approach 1:
The patent merges the electromagnetic shielding function and heat dissipation function into a single integrated component. The heat dissipation shield member provides both electromagnetic shielding to suppress radiation intrusion and thermal conduction paths to manage the heat generated by high-speed communication operations, thereby addressing both requirements simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides improved cooling performance and effective suppression of external electromagnetic radiation and noise, while also reducing costs and enhancing heat dissipation efficiency.
Implementation Method 1
a heat dissipating shield member thermally coupled to the integrated circuit element and grounded
Implementation Method 2
the heat dissipating shield member thermally coupled to the integrated circuit element and grounded, wherein the heat dissipating shield member includes an inner portion accommodated inside the enclosure and thermally coupled to the integrated circuit element and an outer portion extending to an outside of the enclosure via the communication opening
Data Source
AI summary
An electronic control device includes an enclosure including a first enclosure having an assembly opening and a second enclosure covering the entire assembly opening, the enclosure having a communication opening communicating with the assembly opening; a circuit board accommodated in the enclosure; an integrated circuit element mounted on the circuit board; and a heat dissipating shield member thermally coupled to the integrated circuit element and grounded, wherein the heat dissipating shield member includes an inner portion accommodated inside the enclosure and thermally coupled to the integrated circuit element and an outer portion extending to an outside of the enclosure via the communication opening.