Grounded Adhesive Transfer Stamp for ESD-Safe Chip Placement
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Solution Overview
Problem
Conventional methods for transferring semiconductor chips are prone to damage from electrostatic discharges, and existing technologies lack effective solutions for preventing electrostatic discharge (ESD) during the transfer process, particularly for sensitive optoelectronic chips.
Innovation Solution
An adhesive transfer stamp comprising an electrically insulating volume region with an integrated electrically conductive element connected to a ground conductor, which dissipates electrostatic charges, combined with a transparent carrier for optical alignment, effectively suppresses ESD pulses and prevents damage to the semiconductor chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional transfer methods are used, then the transfer process is simple, but electrostatic discharge damage occurs to semiconductor chips
Solution Approach 1:
The transfer stamp combines electrically insulating material (for ESD protection) with electrically conductive elements (for charge dissipation) to create a composite structure that provides both protection and functionality, resolving the contradiction between reliability improvement and structural complexity
Solution Approach 2:
The electrically conductive elements act as intermediaries between the insulating volume region and the ground conductor, providing a controlled path for charge dissipation while maintaining the overall insulating structure needed for ESD protection
2Measurement precision
If the volume region is made transparent, then optical alignment is enabled, but manufacturing complexity increases
Solution Approach 1:
The patent specifies a transparency parameter (extinction coefficient k < 10^-3 at 550 nm) for the insulating material, transforming a qualitative requirement into a quantifiable manufacturing specification that enables precise optical alignment while providing clear manufacturing criteria
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents electrostatic discharge damage to semiconductor chips during transfer by dissipating charges to a ground conductor, allowing for precise optical alignment and successful placement without damaging the chips, especially for sensitive optoelectronic components.
Implementation Method 1
an electrically conductive element, which is provided for being electrically conductively connected to a ground conductor during operation and is configured to dissipate electrical charges from the semiconductor chip to the ground conductor
Implementation Method 2
electrically conductive element, which is provided for being electrically conductively connected to a ground conductor
Implementation Method 3
optical alignment with the aid of a camera system through the transparent adhesive transfer stamp is advantageously possible
Data Source
AI summary
In an embodiment an adhesive transfer stamp for transferring semiconductor chips includes a volume region including an electrically insulating material, at least one adhesive surface configured to receive a semiconductor chip and an electrically conductive element configured to electrically conductively connected to a ground conductor during operation and to dissipate electrical charges from the semiconductor chip to the ground conductor, wherein the volume region is embodied as a solid body, and wherein the volume region has at least one stepped structure.