Grounded Waveguide Structure for Low-Loss 300 GHz Integration
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Solution Overview
Problem
Waveguide devices experience significant propagation loss when guiding high-frequency electromagnetic waves above 30 GHz due to increased leakage and resonance issues, particularly when mounted on support substrates.
Innovation Solution
A waveguide device design featuring an inorganic material substrate with a specific thickness and dielectric properties, along with a conductor layer and earth electrodes, is implemented. This design includes vias for electrical connections and a support substrate configuration that suppresses leakage and resonance, ensuring reduced propagation loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the waveguide device is mounted on a support substrate to guide high-frequency electromagnetic waves (300 GHz or more), then the device can be integrated into industrial products, but propagation loss significantly increases
Solution Approach 1:
The patent introduces a three-layer electrode configuration (first earth electrode on the conductor layer side, second earth electrode between substrate and support, third earth electrode on the support substrate side) to suppress electromagnetic wave leakage in the vertical dimension. This multi-dimensional grounding approach contains the electromagnetic field within the waveguide structure, preventing energy loss to the support substrate while maintaining product integration capability
Solution Approach 2:
The inorganic material substrate with specific thickness (satisfying t ≤ λ/(2π√ε)) acts as an intermediary layer between the conductor layer and support substrate. This intermediate substrate controls electromagnetic wave propagation characteristics, reducing leakage to the support substrate while enabling mechanical integration into industrial products
2Loss of energy
If the inorganic material substrate thickness is reduced to suppress resonance and leakage, then propagation loss decreases, but mechanical strength may be compromised
Solution Approach 1:
The patent specifies a precise thickness parameter for the inorganic material substrate (t ≤ λ/(2π√ε), where λ is wavelength and ε is relative dielectric constant). This parameter optimization suppresses resonance and leakage reducing propagation loss, while the presence of the support substrate and multi-layer electrode structure compensates for mechanical strength requirements
Solution Approach 2:
The waveguide device employs a composite structure combining the inorganic material substrate with the support substrate and multiple electrode layers. This composite construction allows the thin inorganic substrate to fulfill electromagnetic control functions while the overall composite structure maintains adequate mechanical strength through the support substrate
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces propagation loss for high-frequency electromagnetic waves, enabling efficient guidance while maintaining mechanical strength and allowing for substrate thinning, thus supporting future integration and miniaturization.
Implementation Method 1
an inorganic material substrate; a conductor layer arranged above the inorganic material substrate... A thickness 't' of the inorganic material substrate satisfies the following formula (1): t≤λ/(2π×√ε)... where ε represents a relative dielectric constant of the inorganic material substrate at 300 GHz
Implementation Method 2
a support substrate positioned on an opposite side to the conductor layer with respect to the inorganic material substrate... This design includes vias for electrical connections and a support substrate configuration that suppresses leakage and resonance
Implementation Method 3
first earth electrodes each arranged in a direction intersecting the predetermined direction at a distance from the signal electrode... a second earth electrode positioned between the inorganic material substrate and the support substrate... a third earth electrode positioned on an opposite side to the second earth electrode with respect to the support substrate. The first earth electrodes, the second earth electrode, and the third earth electrode are electrically connected to each other
Data Source
AI summary
A waveguide device includes: an inorganic material substrate; a conductor layer including a signal electrode and first earth electrodes; a support substrate positioned on an opposite side to the conductor layer with respect to the inorganic material substrate; a second earth electrode positioned between the inorganic material substrate and the support substrate; and a third earth electrode positioned on an opposite side to the second earth electrode with respect to the support substrate. The first earth electrodes, the second earth electrode, and the third earth electrode are electrically connected to each other. A thickness “t” of the inorganic material substrate satisfies the following formula (1).t<λaε(1)