Grounded Bonding Wire Layout for Compact Module Shielding
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Solution Overview
Problem
Existing wire bonding techniques require extra space on a board surface due to the inclination of wires between joined portions, making it difficult to achieve a compact compartment shield.
Innovation Solution
A module design that includes a board with a first and second component mounted on its surface, where a wire extends across these components, with one end connected to the second component and grounded, optimizing the angle of wire bonding to minimize space usage while providing a compartment shield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding is performed in a two-step process with inclined wires, then electrical connection between components is achieved, but extra space is required on the board surface
Solution Approach 1:
The patent transitions from planar wire routing to three-dimensional vertical wire bonding. The wire extends substantially perpendicular to the board surface, utilizing the vertical dimension to achieve electrical connection without consuming additional horizontal board space. This dimensional change resolves the contradiction by maintaining connection reliability while eliminating the space-wasting inclination issue.
Solution Approach 2:
The patent changes the bonding angle parameter from inclined (small angle with board surface) to perpendicular (substantially 90-degree angle). By modifying this geometric parameter, the wire configuration achieves efficient space utilization on the board surface while maintaining reliable electrical connection between components.
2Ease of manufacture
If wires are routed with small angles to component surfaces, then joining is easier, but more board surface area is consumed
Solution Approach 1:
The invention moves the wire routing from the horizontal plane to the vertical dimension, with wires extending substantially perpendicular to the board surface. This eliminates the need for large bonding angles and reduces the horizontal space requirement while maintaining manufacturability through standard vertical wire bonding processes.
Solution Approach 2:
The patent optimizes the wire bonding angle parameter to be substantially perpendicular (near 90 degrees) to the board surface, changing it from the conventional small angle configuration. This parameter change achieves compact space utilization while remaining compatible with existing wire bonding manufacturing capabilities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The module effectively saves space on the board surface while maintaining a compartment shield with wires, allowing for efficient utilization of space and robust shielding.
Implementation Method 1
a wire disposed to extend across the first component and having one end and the other end, in which the one end is connected to the second component, and the wire is grounded
Data Source
AI summary
A module includes: a board having a first surface; a first component and a second component mounted on the first surface; and a wire disposed to extend across the first component and having one end and the other end. The one end is connected to the second component. The wire is grounded.