Grounding Cap Module for Polymer Control in Plasma Etching
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Solution Overview
Problem
In semiconductor manufacturing, plasma etching processes generate polymers as by-products that adhere to surfaces within the etching chamber, leading to contamination and defects in photomasks used in EUV lithography, which have low tolerance for errors.
Innovation Solution
The etching apparatus incorporates a grounding cap module with a gas injection device that electrically grounds the gas pipe to reduce polymer residue accumulation, using a metal grounding cap module that covers the optical window and is connected to the gas pipe, preventing polymer residues from adhering to the chamber surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If plasma etching processes are used to etch films in semiconductor manufacturing, then various device features can be produced, but polymers are generated as etch by-products that adhere to surfaces within the etching chamber and become dislodged, contaminating the chamber
Solution Approach 1:
A grounding cap module is introduced as an intermediary component between the gas injection device and the etching chamber. This grounding cap serves as a mediator that captures polymer residues before they can contaminate the chamber surfaces, while still allowing the plasma etching process to proceed effectively for device feature production.
Solution Approach 2:
The grounding cap module is designed to extract and remove polymer residues from the gas flow path. By positioning the grounding cap at the gas inlet, polymer by-products are extracted from the main gas stream and deposited on the grounding cap surface, preventing them from reaching and contaminating the chamber surfaces.
2Manufacturing precision
If photomasks are used in EUV lithography with high precision requirements, then very small (14 nm) chips can be produced, but any defects in the photomask will be transferred to the semiconductor substrate
Solution Approach 1:
The grounding cap module performs preliminary action by capturing polymer residues before they can reach the photomask or substrate. By positioning the grounding cap upstream at the gas inlet, potential contaminants are removed in advance, preventing defects from being transferred to the high-precision photomask and substrate during EUV lithography.
3Object-generated harmful factors
If the gas injection device structure is modified to prevent polymer adhesion, then chamber contamination can be reduced, but the original structure of the gas injection device should be maintained
Solution Approach 1:
The grounding cap module is merged with the existing gas injection device structure. Rather than redesigning the entire gas injection system, the grounding cap is integrated as an additional component that combines the functions of gas delivery and polymer residue capture, thereby reducing contamination without significantly increasing device complexity.
Solution Approach 2:
The grounding cap module serves multiple functions: it acts as a grounding element, a polymer residue trap, and a protective barrier for the chamber. This multi-functionality allows it to reduce chamber contamination while maintaining a relatively simple structure that can be integrated into existing gas injection devices.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively minimizes polymer residue accumulation, improving the yield rates of semiconductor devices by maintaining the original structure of the gas injection device and reducing contamination, thus enhancing the precision and reliability of the etching process.
Implementation Method 1
The etching apparatus incorporates a grounding cap module with a gas injection device that electrically grounds the gas pipe to reduce polymer residue accumulation
Implementation Method 2
Dry etching processes, also referred to as plasma etching processes, are carried out to etch various films at various stages of the semiconductor manufacturing operation
Data Source
AI summary
A grounding cap module includes a main body, a frame portion, and a cap portion. The main body includes a first opening penetrating the main body and a grounding portion disposed on a periphery of the main body and configured to be electrically grounded. The frame portion is disposed on the main body and includes a second opening aligned with the first opening. The cap portion is disposed on the frame portion and covers the second opening, wherein the first opening, the second opening and the cap portion define a receiving cavity. A gas injection device and an etching apparatus using the same are also provided.