Grounding Point Retrofit for Preexisting Dissipative Coatings

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Solution Overview

Problem

There is no existing solution to add additional grounding points to a preexisting dissipative coating system without removing the existing coating.

Innovation Solution

A method involving placing an electrically conductive insert into a preexisting dissipative coating layer, followed by an electrically conductive layer in proximity, fastening them together, and connecting to an equipotential bonding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If grounding devices are installed before applying the dissipative coating, then the coating can be properly grounded, but the grounding points cannot be added to preexisting dissipative coatings without removing the coating

Engineering Contradiction:

Improveability to add grounding points to preexisting dissipative coatingsVSAvoidprocess complexity of adding grounding points

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The grounding system is divided into separate components: a grounding conductor embedded in the dissipative coating, a conductive layer applied on top, and a grounding point element. This segmentation allows the grounding functionality to be added in stages without removing the existing coating, resolving the contradiction between adaptability and ease of manufacture.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The grounding conductor is embedded within the dissipative coating layer, while the conductive layer is applied over it, creating a nested structure. This nested arrangement enables the grounding points to be added to preexisting coatings by integrating multiple functional layers without removing the original coating structure.

Inventive Principle:

Principle #7Nested doll (Nesting)

2Reliability

If additional grounding points are added to preexisting dissipative coatings, then ESD protection is enhanced, but the existing coating must be removed

Engineering Contradiction:

ImproveESD protection capabilityVSAvoiddissipative coating material

Core Design Contradiction:

ReliabilityVSLoss of substance

Solution Approach 1:

The grounding conductor is embedded in the dissipative coating during the initial application, and the conductive layer is applied subsequently. This preliminary action allows additional grounding points to be added to preexisting coatings without removing the dissipative coating material, maintaining both ESD protection capability and coating integrity.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The system uses a composite structure combining the dissipative coating, embedded grounding conductor, and conductive layer. This composite material approach enables enhanced ESD protection by integrating multiple functional materials while preserving the existing dissipative coating, avoiding material loss.

Inventive Principle:

Principle #40Composite materials

3Adaptability or versatility

If grounding conductors are installed before coating application, then grounding is established, but the system cannot be modified to add grounding points later

Engineering Contradiction:

Improvemodifiability of grounding pointsVSAvoidgrounding system structure

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The grounding system is designed with dynamic adaptability through the embedded grounding conductor that can be accessed and connected at different locations. The conductive layer provides a flexible interface for adding grounding points without altering the fundamental grounding structure, enabling system modification while managing complexity.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The conductive layer serves as an intermediary between the embedded grounding conductor and the grounding point elements. This intermediary layer enables the system to be modified by providing a accessible interface for adding grounding points without increasing the complexity of the underlying grounding infrastructure.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables safe and fast installation of additional grounding points to a preexisting dissipative coating system, maintaining compliance with electrostatic discharge standards.

Implementation Method 1

employing a method comprising the steps of: i) placing an electrically conductive insert (1) into a preexisting dissipative coating layer (2); ii) placing an electrically conductive layer (3) on the preexisting dissipative coating layer (2) in proximity of the conductive insert (1)

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 2

the requirement is for floors and walls with low resistances to ground, which dissipate electrostatic charging immediately and in a controlled manner

Methodology Applied

Scientific EffectElectrostatic discharge: Electrostatic Discharge

Data Source

PatentUS20250382805A1Subsequent placing of earthing points

Publication Date: 2025.12.18 SIKA TECH AG

AI summary

A method of adding a grounding point to a preexisting dissipative coating layer includes the consequent steps of: placing an electrically conductive insert into a preexisting dissipative coating layer; placing an electrically conductive layer on the preexisting dissipative coating layer in proximity of the conductive insert; fastening the electrically conductive layer to the electrically conductive insert; connecting the electrically conductive layer and/or the electrically conductive insert to an equipotential bonding. The method is for a safe and fast installation of additional grounding points for a preexisting dissipative coating or system without removing the preexisting dissipative coating or system.