Grounding Strap Geometry to Reduce Deposition Tool Particulates

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Solution Overview

Problem

The existing semiconductor deposition tools face issues with contamination due to particulates dislodged from the pumping plate component by the grounding strap, leading to reduced yield and increased downtime, and the grounding strap's plastic deformation exacerbates these problems.

Innovation Solution

The introduction of a grounding component with a deformation region featuring a recessed edge in the grounding strap reduces the likelihood of rubbing against the pumping plate component, minimizing particulate dislodgment and plastic deformation, thereby improving yield and reducing downtime.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a grounding strap is used to discharge plasma residual charge, then electrical safety is improved, but particulates are dislodged from the pumping plate component causing contamination

Engineering Contradiction:

Improveelectrical safetyVSAvoidparticulate contamination

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

A compliant grounding component is introduced as an intermediary between the substrate stage and pumping plate. This component provides the necessary electrical grounding function while its compliant nature allows it to conform to surface irregularities without dislodging particulates, thus mediating between the electrical safety requirement and contamination prevention

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If the grounding strap is made compliant to improve electrical contact, then electrical conductivity is improved, but plastic deformation occurs causing rubbing against the pumping plate

Engineering Contradiction:

Improveelectrical conductivityVSAvoidstructural stability

Core Design Contradiction:

ReliabilityVSStability of the object's composition

Solution Approach 1:

The grounding component's material properties are optimized by adjusting parameters such as hardness, elasticity, and tensile strength. These parameter changes enable the component to maintain compliance for electrical contact while resisting plastic deformation that would cause rubbing and contamination

Inventive Principle:

Principle #35Parameter changes

3Object-affected harmful factors

If frequent servicing of the grounding component is performed to maintain cleanliness, then contamination is reduced, but tool downtime increases

Engineering Contradiction:

Improvecontamination levelVSAvoidtool downtime

Core Design Contradiction:

Object-affected harmful factorsVSLoss of time

Solution Approach 1:

The compliant grounding component is designed to self-maintain its functional properties through its material characteristics. It naturally resists particulate dislodgment and plastic deformation, reducing the need for frequent manual servicing while maintaining electrical conductivity and cleanliness

Inventive Principle:

Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design effectively decreases the frequency of servicing the grounding component, enhances the yield of semiconductor products, and increases the throughput of the deposition tool by minimizing contamination and downtime.

Implementation Method 1

The grounding component includes a grounding strap and a coupling component that couples attach regions at opposing ends of the grounding strap to form an elliptical portion of the grounding component

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS20250364295A1Semiconductor processing tool and methods of operation

Publication Date: 2025.11.27 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

Some implementations described herein provide a deposition tool that includes a grounding component between an edge ring of a substrate stage and a pumping plate component. The grounding component includes a grounding strap having a deformation region. The deformation region includes a recessed edge to reduce a likelihood of the grounding strap rubbing against a surface of the pumping plate component during operation of the deposition tool. Material properties of the grounding strap may reduce a likelihood of plastic deformation of the grounding strap during repeated cycling. In this way, an amount of particulates dislodged from the surface of the pumping plate component may be decreased to improve a yield of semiconductor product fabricated using the deposition tool. Furthermore, a frequency of servicing the grounding component may be decreased to decrease a downtime of the deposition tool and increase a throughput of semiconductor product fabricated using the deposition tool.