Grouped Memory Die Identification on a Shared Command Bus
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Solution Overview
Problem
In memory systems with grouped memory dies sharing a common command/address channel, individual access to each memory die is challenging due to the lack of assigned locations during manufacturing, leading to increased processing overhead as all dies receive commands intended for one, resulting in inefficiency.
Innovation Solution
Each memory die includes a location detection circuit that outputs an identifier based on received signals, which is stored in non-volatile read-only memory, allowing for subsequent identification and individual access despite shared channel usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If multiple memory dies share a common command/address channel, then device complexity is reduced and manufacturing is simplified, but individual access to each memory die becomes difficult and processing overhead increases
Solution Approach 1:
The patent applies preliminary action by detecting and storing the location identifier of each memory die during manufacturing or initialization, before actual memory operations begin. This pre-stored identifier enables the memory controller to subsequently address individual dies efficiently without requiring complex real-time detection mechanisms during operation.
Solution Approach 2:
The patent introduces an intermediary location identifier as a unique code stored in each memory die that mediates between the shared command/address channel and individual die identification. This intermediary enables the memory controller to distinguish between multiple dies sharing the same channel by reading their unique identifiers.
2Measurement precision
If location detection circuits are added to each memory die, then individual die identification becomes possible, but device complexity and manufacturing complexity increase
Solution Approach 1:
The location detection circuit is configured to detect and output the location identifier during manufacturing or initialization, storing it in non-volatile memory. This preliminary detection eliminates the need for complex continuous detection mechanisms during normal operation, reducing overall device complexity while maintaining precise identification capability.
Solution Approach 2:
Each memory die contains its own location detection circuit that autonomously detects and outputs its unique location identifier without requiring external intervention. This self-service approach simplifies the overall system architecture by distributing the identification function to each individual die rather than requiring a centralized detection mechanism.
Data Source
AI summary
Methods, systems, and devices for die location detection for grouped memory dies are described. A memory device may include multiple memory die that are coupled with a shared bus. In some examples, each memory die may include a circuit configured to output an identifier associated with a location of the respective memory die. For example, a first memory die may output a first identifier, based on receiving one or more signals, that identifies a location of the first memory die. Identifying the locations of the respective memory dies may allow for the dies to be individually accessed despite being coupled with a shared bus.