Guard Ring Resonant Circuit Noise Suppression
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Solution Overview
Problem
Semiconductor devices with multiple integrated circuits face performance degradation due to noise interference between circuits, particularly from digital circuits to RF/analog circuits, which introduces signal cross-talk and degrades the overall performance.
Innovation Solution
A semiconductor device design incorporating a guard ring surrounding noise-sensitive circuits and a resonant circuit coupled with the guard ring, comprising an inductor and capacitor, which suppresses noise by dissipating it to a ground node, thereby isolating the second circuit from noise interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple circuits are integrated on the same substrate, then device functionality and productivity are improved, but noise interference between circuits increases causing performance degradation
Solution Approach 1:
The substrate is segmented into multiple isolation regions that physically separate different circuits. Each isolation region acts as an independent compartment that prevents noise propagation between adjacent circuits while maintaining their functional integration on the same substrate.
Solution Approach 2:
Shielding structures are introduced as intermediary elements between noisy circuits and noise-sensitive circuits. These shielding structures act as mediators that block or absorb electromagnetic noise while allowing the circuits to remain integrated and functional.
2Object-affected harmful factors
If shielding structures are added to reduce noise interference, then noise suppression is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The shielding structures are merged with the substrate formation process itself. The isolation regions and shielding structures are created as integrated features during semiconductor manufacturing, combining multiple functions into a unified structure that reduces overall device complexity.
Solution Approach 2:
The isolation regions serve multiple functions simultaneously: they provide physical separation between circuits, act as shielding structures for noise reduction, and define circuit boundaries. This multi-functionality reduces the need for additional dedicated shielding components.
3Object-affected harmful factors
If traditional shielding methods are used, then noise interference is reduced, but additional power consumption is required
Solution Approach 1:
The shielding structures are designed to function passively without requiring external power sources. The isolation regions and shielding elements utilize the inherent electrical properties of the substrate and circuit operations to provide noise suppression automatically, eliminating the need for powered active shielding circuits.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses noise by up to 20 dB across various frequency ranges, improving the performance of noise-sensitive circuits by reducing signal cross-talk and noise interference, without consuming additional power.
Implementation Method 1
a resonant circuit coupled with the guard ring. The resonant circuit comprises an input node coupled with the guard ring, an inductor, a capacitor coupled with the inductor, and a ground node configured to carry a ground voltage
Data Source
AI summary
A semiconductor device comprises a guarded circuit. The semiconductor device also comprises a guard ring surrounding the guarded circuit. The semiconductor device further comprises a resonant circuit coupled with the guard ring. The resonant circuit comprises an input node coupled with the guard ring. The resonant circuit also comprises an inductor. The resonant circuit further comprises a capacitor coupled with the inductor. The resonant circuit additionally comprises a ground node configured to carry a ground voltage. The inductor and the capacitor are coupled between the input node and the ground node.