Guard Ring Segmentation for Ion Diffusion and Arcing

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Solution Overview

Problem

The formation of guard rings in semiconductor components can lead to electrical charge buildup and arcing during the construction process, which is detrimental to the components and affects their reliability.

Innovation Solution

The design includes a guard ring structure with connecting bridges of material to dissipate electrical charges and minimize arcing, featuring barriers with end-to-end orientations and openings between them to block ion diffusion and crack propagation, while providing mechanical benefits and contamination protection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a continuous guard ring barrier is formed to block ion diffusion and crack propagation, then protection reliability is improved, but electrical charge buildup and arcing occur during construction

Engineering Contradiction:

Improveprotection reliabilityVSAvoidelectrical charge buildup and arcing

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The continuous guard ring barrier is segmented into discrete barrier portions with gaps between them. These gaps allow electrical charge to dissipate during the construction process, preventing charge buildup and arcing. The barrier portions are arranged to provide protection against ion diffusion and crack propagation while the gaps maintain electrical discharge pathways.

Inventive Principle:

Principle #1Segmentation

2Reliability

If barrier portions are positioned end-to-end to maximize protection coverage, then crack propagation blocking is improved, but electrical charge dissipation is reduced

Engineering Contradiction:

Improvecrack propagation blockingVSAvoidelectrical charge dissipation

Core Design Contradiction:

ReliabilityVSLoss of energy

Solution Approach 1:

The barrier portions are positioned to provide localized protection at critical regions where crack propagation is most likely to occur. The gaps between barrier portions are strategically placed to maintain electrical charge dissipation pathways. This local quality approach ensures that protection is provided where most needed while maintaining electrical safety.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach effectively reduces electrical charge buildup and arcing, enhancing the reliability of semiconductor components by preventing crack propagation and contaminant entry while maintaining structural reinforcement and contamination barriers.

Implementation Method 1

a barrier having a first barrier portion and a second barrier portion oriented end to end to block ion diffusion and crack propagation in an electronic component

Methodology Applied

Scientific EffectIon diffusion blocking: Diffusion Barrier

Implementation Method 2

The design includes a guard ring structure with connecting bridges of material to dissipate electrical charges and minimize arcing

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 3

a barrier having a first barrier portion and a second barrier portion oriented end to end to block ion diffusion and crack propagation in an electronic component

Methodology Applied

Scientific EffectCrack propagation blocking: Fracture Mechanics

Data Source

PatentUS11018097B2Electronic component guard ring

Publication Date: 2021.05.25 INTEL NDTM US LLC

AI summary

Guard ring technology is disclosed. In one example, an electronic component guard ring can include a barrier having a first barrier portion and a second barrier portion oriented end to end to block ion diffusion and crack propagation in an electronic component. The guard ring can also include an opening in the barrier between the first and second barrier portions extending between a first side and a second side of the barrier. Associated systems and methods are also disclosed.