Semiconductor Guard Trenches With Intermediate Voltage Isolation

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Solution Overview

Problem

Existing semiconductor devices struggle to effectively isolate high voltage regions from low voltage regions on semiconductor chips, leading to potential breakdown across surface junctions, especially when the voltage difference is large.

Innovation Solution

A guard structure comprising a first layer of a first type of semiconductor in contact with a second layer of a second type of semiconductor, with trenches between high and low voltage regions to isolate them, and an intermediary voltage applied to a sub-region between the trenches to split the voltage drop and prevent breakdown.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If a single trench is used to isolate high voltage region from low voltage region, then the structure is simple, but breakdown occurs across the trench when voltage difference is large

Engineering Contradiction:
Improveisolation structureVSAvoidbreakdown prevention
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The isolation structure is segmented into multiple trenches (first trench and second trench) instead of using a single trench. This segmentation divides the voltage drop across multiple barriers, reducing the electric field strength at each individual trench interface and preventing breakdown even when the overall voltage difference is large.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A sub-region of the second layer is introduced as an intermediary between the high voltage region and low voltage region. This intermediary sub-region is isolated from both high and low voltage regions by the trenches, allowing it to assume an intermediate voltage potential that further reduces the voltage gradient across each trench interface.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If guard ring structure is used to prevent voltage breakdown, then breakdown prevention is improved, but current leakage occurs through the semiconductor layer below the rings

Engineering Contradiction:
Improvebreakdown preventionVSAvoidcurrent leakage
Core Design Contradiction:
ReliabilityVSLoss of energy

Solution Approach 1:

The harmful conductive path through the semiconductor layer is extracted and removed by forming trenches that extend through the second layer. This eliminates the continuous material path that would allow current leakage, while the trenches themselves provide the isolation barrier.

Inventive Principle:
Principle #2Taking out (Extraction)

3Reliability

If trench isolation is used between high voltage and low voltage regions, then isolation effectiveness is improved, but breakdown across the trench occurs with large voltage differences

Engineering Contradiction:
Improveisolation effectivenessVSAvoidbreakdown across trench
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The isolation structure is segmented into multiple trenches (first trench and second trench) instead of using a single trench. This segmentation divides the voltage drop across multiple barriers, reducing the electric field strength at each individual trench interface and preventing breakdown even when the overall voltage difference is large.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A sub-region of the second layer is introduced as an intermediary between the high voltage region and low voltage region. This intermediary sub-region is isolated from both high and low voltage regions by the trenches, allowing it to assume an intermediate voltage potential that further reduces the voltage gradient across each trench interface.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The proposed solution effectively isolates high voltage regions from low voltage regions by splitting the voltage drop across multiple trenches, thereby preventing breakdown and ensuring reliable operation even with large voltage differences.

Implementation Method 1

the intermediary voltage having a value between the voltages of the respective high and low voltage regions... splitting the voltage drop across multiple trenches

Methodology Applied
Scientific EffectVoltage drop distribution: Electric Field

Data Source

PatentUS12278264B2Semiconductor structure and method for guarding a low voltage surface region from a high voltage surface region
Publication Date: 2025.04.15 SEARCH FOR THE NEXT LTD
  • US12278264B2 patent drawing
  • US12278264B2 patent drawing
  • US12278264B2 patent drawing

AI summary

A structure and method for guarding a high voltage region at a semiconductor surface from a low voltage region at the semiconductor surface. The structure comprising at least two trenches between the high and low voltage regions to isolate the high voltage region from the low voltage region. The trenches are spaced apart so as to define a sub-region therebetween. To prevent breakdown across the trenches, an intermediate voltage, i.e., of a value between the voltages of the high and low voltage regions, is applied to the sub-region so as to reduce the voltage drop across each trench. Preferably this is achieved by providing an integrated voltage divider circuit that connects between the high and low voltage regions and has an output connected to the sub-region by which the intermediate voltage is applied to the sub-region.