Guarding Member for Chip Component-Embedded Resin Substrates
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Solution Overview
Problem
In the manufacturing of chip component-embedded resin multilayer substrates, the flowing resin can deform wiring conductors and cause short-circuits with chip components due to the formation of gaps between the resin layers and side terminal electrodes.
Innovation Solution
A guarding member, electrically isolated from the wiring conductor and formed from a material with a melting point higher than the resin's flow temperature, is placed to cover the boundary between the side terminal electrodes and resin layers, reducing resin flow and preventing deformation of the wiring conductors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the dimensions of the open space are made slightly greater than the dimensions of the chip component to prevent the chip component from being caught, then the chip component can be easily embedded, but a gap is formed between the side surface of the chip component and the resin layers
Solution Approach 1:
A guarding member is introduced as an intermediary element between the chip component and the resin layers. This guarding member covers the boundary between the side terminal electrode and the resin layers, preventing direct contact between the resin and the terminal electrode while maintaining the necessary clearance for easy embedding.
Solution Approach 2:
The guarding member is provided in advance before the resin lamination process. By pre-positioning the guarding member to cover the boundary area, the design prevents resin intrusion into the gap region before the actual embedding occurs, thus avoiding the need for post-processing adjustments.
2Ease of manufacture
If a wiring conductor is formed in the vicinity of the gap, then electrical connections can be established, but the flowing resin during thermo-compression can deform the wiring conductor and cause short-circuits
Solution Approach 1:
The guarding member serves as a protective intermediary that covers the boundary region where wiring conductors are located. This physical barrier prevents the resin from directly contacting and deforming the wiring conductors during thermo-compression, while still allowing the wiring conductor to maintain its electrical connection function.
Solution Approach 2:
The guarding member is positioned in advance to counteract the harmful effect of resin flow on the wiring conductor. By covering the boundary area before resin injection, the guarding member preemptively blocks the resin from reaching and deforming the wiring conductor, thus preventing potential short-circuits.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively prevents wiring conductor deformation and short-circuits, maintaining the electrical characteristics of the multilayer substrate and modular component without affecting their performance.
Implementation Method 1
the guarding member is formed from a material having a melting point higher than a temperature at which the resin layer begins to flow
Implementation Method 2
a thermo-compression step of thermo-compressing the laminating body embedded with the chip component
Implementation Method 3
when a laminating body obtained by laminating resin layers 1 is thermo-compressed
Data Source
AI summary
The present invention provides a chip component-embedded resin multilayer substrate including a laminating body obtained by laminating a plurality of resin layers, a predetermined wiring conductor disposed in the laminating body, and a chip component embedded in the laminating body and having a side terminal electrode. A guarding member electrically isolated from the wiring conductor is provided to cover at least a part of a boundary between the side terminal electrode and the resin layers when viewed from a lamination direction of the laminating body, and the guarding member is formed from a material having a melting point higher than a temperature at which the resin layer begins to flow.