Guide Jig Positioning for Preform Solder Separation Control
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Solution Overview
Problem
The preform solder separation phenomenon during semiconductor manufacturing leads to soldering defects, making it difficult to visually ascertain the separation and resulting in defects such as components being bonded to incorrect positions or not attached correctly.
Innovation Solution
A transfer apparatus with a guide jig featuring partition walls and accommodation guide holes, along with preform solders having bent portions, is used to prevent preform solder separation by restricting its position and preventing movement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If preform solder is moved by conveyor during semiconductor manufacturing, then productivity is improved, but preform solder separation occurs due to inertia causing soldering defects
Solution Approach 1:
The guide jig is designed with accommodation guide holes and partition walls that pre-position the preform solder before the soldering process. This preliminary positioning action ensures the preform solder remains at the correct location even during conveyor movement, preventing separation defects while maintaining manufacturing efficiency
Solution Approach 2:
The guide jig acts as an intermediary device between the conveyor system and the preform solder. It provides a stable reference framework with partition walls that constrain the preform solder, isolating it from the inertial forces generated during conveyor movement and preventing positioning errors
2Adaptability or versatility
If components are stacked on preform solder, then device integration is improved, but visual detection of preform solder separation becomes difficult
Solution Approach 1:
The guide jig serves as a visible intermediary reference structure that remains exposed even when components are stacked on the preform solder. The partition walls and accommodation guide holes provide a visual framework that makes it easy to detect any preform solder separation, maintaining defect detectability while allowing component integration
3Reliability
If guide jig with partition walls is used to prevent preform solder separation, then soldering quality is improved, but device complexity increases
Solution Approach 1:
The guide jig is segmented into multiple partition walls that create individual accommodation guide holes for each preform solder position. This segmentation provides precise positioning for each solder element while keeping each individual partition simple in structure, improving soldering quality without excessive complexity
Solution Approach 2:
The guide jig performs multiple functions simultaneously: it positions the preform solder, prevents separation during conveyor movement, and provides visual reference for defect detection. This multi-functionality reduces the need for additional separate devices, improving soldering quality while limiting the increase in overall device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents soldering defects by maintaining the preform solder in designated positions, improving the yield of power semiconductor production.
Implementation Method 1
a guide jig disposed above an upper surface of the substrate, the guide jig including a plurality of partition walls and a plurality of accommodation guide holes partitioned by the plurality of partition walls
Implementation Method 2
a preform solder disposed on the upper surface of the substrate, the preform solder including a plurality of bent portions, wherein the plurality of bent portions include a first bent portion formed adjacent to one end of a body; and a second bent portion formed adjacent to the other end of the body
Data Source
AI summary
A transfer apparatus for semiconductor manufacturing, the transfer apparatus including: a carrier configured to move; a substrate disposed on the carrier; a guide jig disposed above an upper surface of the substrate, the guide jig including a plurality of partition walls and a plurality of accommodation guide holes partitioned by the plurality of partition walls; and a preform solder disposed on the upper surface of the substrate, the preform solder including a plurality of bent portions, wherein the plurality of bent portions include a first bent portion formed adjacent to one end of a body; and a second bent portion formed adjacent to the other end of the body.