Guide Posts for Wire Bonding on Flexible RF Transponders
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Solution Overview
Problem
The challenge in manufacturing RF transponders lies in creating functional and economically competitive structures on flexible substrates, where the print-and-etch process for wiring patterns is expensive and generates hazardous waste, and wire bonding fine gauge round wire to electronic devices is difficult due to the wire's rounded surface and adhesive binding, making it hard for automated machines to locate and form strong joints.
Innovation Solution
A support structure with guide posts is used to facilitate wire bonding by wrapping electrically conductive round wire around the posts, creating defined bond sites that simplify the identification and connection of electronic devices to the wire, eliminating the need for image processing to locate bonding sites and reducing the use of hazardous chemicals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If print-and-etch process is used to create wiring patterns, then wiring patterns can be formed on substrate, but expensive chemicals are required and hazardous waste is generated
Solution Approach 1:
The patent extracts the harmful chemical etching process from the wiring pattern formation and replaces it with a mechanical wire wrapping process. The conductive trace is created by physically wrapping conductive material around guide posts rather than chemically etching it, eliminating hazardous waste while maintaining the wiring pattern formation capability
Solution Approach 2:
The patent changes the fundamental parameter of trace formation from chemical etching to mechanical deformation. By wrapping conductive material around guide posts, the trace is formed through physical shaping rather than chemical removal, fundamentally altering the manufacturing parameter from chemical process to mechanical process
2Adaptability or versatility
If fine gauge round wire is used for wiring, then wiring flexibility is improved, but wire bonding is difficult due to rounded surface and adhesive binding
Solution Approach 1:
The patent introduces guide posts as intermediary elements that mediate between the fine gauge round wire and the bonding process. The guide posts provide a mechanical interface that holds the wire in a controlled position, allowing automated bonding machines to reliably locate and bond to the wire despite its rounded surface and flexibility
Solution Approach 2:
The patent performs preliminary action by pre-positioning the wire around guide posts before the bonding process. The wire is wrapped around the guide posts in advance, which establishes precise locations where bonding can occur and eliminates the need for image processing to locate bond sites during automated manufacturing
3Productivity
If automated wire bonding is used, then productivity is improved, but locating bond sites on round wire wrapped in adhesive is difficult
Solution Approach 1:
The patent makes the bond sites visually distinct by wrapping the wire around guide posts, which creates visible geometric features (circles or arcs) that contrast with the surrounding adhesive material. This visual differentiation allows automated imaging systems to easily detect and locate bond sites without complex image processing
Solution Approach 2:
The guide posts serve as visual intermediaries that create detectable features on the wire. The posts provide a physical and visual reference that automated bonding machines can use to locate bond sites, bridging the gap between the invisible wire embedded in adhesive and the detection system
Data Source
AI summary
A disclosed circuit arrangement includes a support structure having first and second posts. Electrically conductive round wire has a round cross-section, and a first portion is wrapped at least partially around the first post. A second portion of the wire extends in a straight line from a point on a perimeter of the first post to a point on a perimeter of the second post, and a third portion of the wire is wrapped at least partially around the second post. The second portion of the round wire defines one or more bond sites. An electronic device is electrically connected to the round wire at one of the one or more bond sites.