Movable Guide Ring Layout for Spin Chuck Liquid Recovery

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Solution Overview

Problem

Existing substrate processing apparatuses face challenges in efficiently recovering scattered treatment liquids due to interference between the spin chuck and guide ring, difficulty in transferring substrates with a guide ring, and the need to adjust the height of the spin chuck for back nozzle operation.

Innovation Solution

A substrate processing apparatus with a movable guide ring unit and chuck pin that allows simultaneous vertical and horizontal movement, enabling the guide ring to be positioned at different heights relative to the spin chuck, and separate recovery paths for different treatment liquids, while avoiding interference with transfer robots.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If a guide ring is provided adjacent to the spin chuck to guide scattered treatment liquid, then the recovery rate of treatment liquid is improved, but interference occurs between the guide ring and substrate during transfer

Engineering Contradiction:
Improverecovery rate of treatment liquidVSAvoidinterference between guide ring and substrate
Core Design Contradiction:
Loss of energyVSObject-affected harmful factors

Solution Approach 1:

The guide ring is made movable relative to the spin chuck through a guide ring support that can shift position. During substrate transfer, the guide ring moves to a first position away from the spin chuck to avoid interference. During treatment liquid recovery, it moves to a second position adjacent to the spin chuck to guide the liquid, thus dynamically adapting its position to different operational requirements

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The guide ring system is divided into separate functional components: the guide ring itself, the guide ring support for positioning, and the driver for actuation. This segmentation allows independent control of the guide ring's position, enabling it to be moved to different locations (first position for transfer, second position for recovery) without affecting the spin chuck or substrate

Inventive Principle:
Principle #1Segmentation

2Adaptability or versatility

If the spin chuck height is adjusted to accommodate a back nozzle for lower surface cleaning, then the cleaning capability is improved, but substrate transfer becomes difficult

Engineering Contradiction:
Improvecleaning capability of spin chuckVSAvoidsubstrate transfer operation
Core Design Contradiction:
Adaptability or versatilityVSEase of operation

Solution Approach 1:

The guide ring's vertical position is dynamically adjusted relative to the spin chuck. During substrate transfer, the guide ring is positioned at a first height that does not interfere with the transfer robot's access to the spin chuck. During treatment liquid recovery, it moves to a second height adjacent to the spin chuck, eliminating the need to adjust spin chuck height for back nozzle operation

Inventive Principle:
Principle #15Dynamics

3Ease of operation

If the spin chuck and cup are spaced apart to avoid interference during substrate loading and unloading, then substrate transfer is facilitated, but scattered treatment liquid is not recovered through the appropriate cup

Engineering Contradiction:
Improvesubstrate loading and unloadingVSAvoidrecovery of scattered treatment liquid
Core Design Contradiction:
Ease of operationVSLoss of energy

Solution Approach 1:

The guide ring acts as an intermediary element between the spin chuck and the cup. It is positioned adjacent to the spin chuck to guide scattered treatment liquid toward the cup, while the spin chuck and cup remain spaced apart to allow substrate transfer. The guide ring bridge s the gap, enabling liquid recovery without requiring the spin chuck and cup to be in direct contact or close proximity

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS20250218854A1Substrate processing apparatus
Publication Date: 2025.07.03 SYSTEM ENGINEERING MEGA SOLUTION CO LTD
  • US20250218854A1 patent drawing
  • US20250218854A1 patent drawing
  • US20250218854A1 patent drawing

AI summary

A substrate processing apparatus includes a support unit capable of driving a guide ring unit and a chuck pin at the same time. According to an example embodiment, the vertical movement of a spin chuck and the horizontal movement of the chuck pin may be performed simultaneously.