Guide Structure for Multi-Fan Heat Dissipation in Thin Electronics
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Solution Overview
Problem
E-sports notebook computers with a light and portable design face challenges in achieving effective heat dissipation without increasing thickness, as existing designs often suffer from turbulence in air flow generated by multiple fans, leading to inefficient heat removal.
Innovation Solution
The electronic device incorporates a guide structure located between fans, which directs air flow to efficiently pass through a heat generating element and exit the housing, preventing turbulence and maintaining a thin design by using a combination of fans and a guide structure to enhance heat dissipation without adding thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If multiple fans are used to enhance heat dissipation, then heat dissipation performance is improved, but air flow turbulence increases and efficiency decreases
Solution Approach 1:
The patent introduces a guide structure as an intermediary component between multiple fans and the heat generating element. This guide structure includes guide walls that direct and organize air flows from different fans, preventing turbulence and interference. The guide structure acts as a mediator that coordinates the air flows, allowing multiple fans to work together efficiently without compromising heat dissipation performance or air flow efficiency.
2Temperature
If heat dissipation components are added to improve cooling, then heat dissipation effect is enhanced, but device thickness increases
Solution Approach 1:
The guide structure is designed to extend in the lateral direction within the housing rather than increasing the thickness of the device. The guide walls are positioned between the fans and extend toward the outlet, utilizing the available lateral space to organize air flows. This dimensional approach allows effective heat dissipation to be achieved without compromising the thin and portable design of the electronic device.
3Temperature
If fans are positioned to face outward for cooling, then heat removal is improved, but air flow interference occurs
Solution Approach 1:
The guide structure serves as a mediator between the fans and the external environment. The guide walls direct the air flows from multiple fans along predetermined paths, ensuring that the flows remain stable and do not interfere with each other before exiting the housing. This intermediary structure maintains air flow stability while still achieving effective heat removal.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively dissipates heat generated during operation, improving the heat dissipation effect while maintaining the device's thin and portable design, by guiding air flow to prevent interference between fan outputs and stabilize airflow, thus reducing turbulence and enhancing cooling efficiency.
Implementation Method 1
air flow generated from the fans is guided by the guide structure to first flow though the heat generating element. In this way, heat generated by the heat generating element is taken away by the air flow
Data Source
AI summary
Provided is an electronic device. The electronic device includes a housing, a heat generating element, a plurality of fans, and a guide structure. The housing includes a first outlet. The heat generating element is disposed in the housing. The fans are disposed in the housing. Each fan includes a second outlet. The second outlets at least partially face the interior of the housing. The guide structure is disposed in the housing, and is at least partially located between the fans. The guide structure at least partially extends toward the first outlet.