Guide Vane Compensation for Thermal Expansion

The patent applies thermal expansion by selecting materials with different expansion coefficients for the compensation element and connection element. The compensation element has a higher thermal expansion coefficient, causing it to expand more during heating and push the adjusting element radially outward to compensate for housing expansion. This material selection strategy eliminates the need for precise spacer positioning and complex mounting procedures while maintaining reliable centering accuracy.

The patent implements dynamics by replacing the rigid connection with a hinged connection between the compensation element and adjusting element. This hinge allows relative rotational movement, enabling the connection structure to adapt dynamically to thermal expansion differences. During heating, the compensation element expands and pushes the adjusting element outward through the hinged connection, maintaining adjustment precision while avoiding deformation or jamming that would occur with a rigid connection.

The patent applies merging by integrating the compensation function directly into the connection structure between the adjusting element and housing. Instead of using separate distributed compensation devices, the hinged connection elements themselves perform the compensation function through their ability to accommodate thermal expansion differences. This integration reduces the number of components and simplifies the overall structure while maintaining centering accuracy through the material-based thermal compensation mechanism.