Liquid-Cooled Electronic Assembly With Guided Coolant Channels
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Solution Overview
Problem
The use of cooling liquid in electronic devices to dissipate thermal energy increases costs due to the need for a large volume, necessitating the omission of fans, which compromises thermal dissipation efficiency.
Innovation Solution
Incorporating a filling component that covers or is disposed between electronic components, forming liquid channels to guide and limit the flow of cooling liquid, enhancing thermal dissipation while reducing the volume and cost of cooling liquid required.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a fan is used for thermal dissipation, then thermal dissipation efficiency is improved, but device complexity and space occupation increase
Solution Approach 1:
The patent extracts and removes the fan component from the electronic device, replacing it with a liquid cooling system that uses cooling liquid flowing through liquid channels to achieve thermal dissipation without mechanical moving parts
Solution Approach 2:
The patent implements a liquid cooling system where cooling liquid flows through liquid channels formed by the filling component, using hydraulic principles to transfer heat from electronic components to the cooling liquid for thermal dissipation
2Temperature
If cooling liquid volume is increased to fill the cooling slot, then thermal dissipation capability is improved, but cost increases
Solution Approach 1:
The patent creates localized liquid channels within the filling component that are positioned to directly contact or closely approach thermal source regions, concentrating cooling liquid flow where heat generation occurs most intensively rather than uniformly filling the entire cooling slot
Solution Approach 2:
The filling component acts as an intermediary structure that contains and directs cooling liquid through specific liquid channels, mediating between the cooling liquid reservoir and thermal sources to achieve efficient heat transfer with reduced liquid volume
3Temperature
If cooling liquid flows freely through the cooling slot, then thermal exchange is improved, but cooling liquid volume requirement increases
Solution Approach 1:
The patent segments the cooling liquid flow path into defined liquid channels within the filling component, creating multiple localized flow paths that efficiently reach thermal sources without requiring a large volume of cooling liquid to fill the entire cooling slot
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The filling component enhances thermal dissipation capability by limiting cooling liquid flow and reducing volume, thereby optimizing thermal exchange with thermal sources while minimizing cooling liquid usage and costs.
Implementation Method 1
The cooling liquid is configured to exchange a thermal with the thermal source region
Implementation Method 2
The cooling liquid is configured to exchange a thermal with the thermal source region
Data Source
Figure 1
Figure 2A
Figure 2B
AI summary
An electronic device is provided. The electronic device is disposed in a cooling liquid of a cooling slot. The electronic device includes a carrier portion, an electronic component, a thermal source region and a filling component. The carrier portion includes a plurality of side walls and a carrier main body. The plurality of side walls are disposed around the carrier main body to form a first accommodation space and a second accommodation space. The electronic component includes a thermal source disposed in the second accommodation space of the carrier portion. The thermal source region is disposed in the carrier portion and corresponding in position to the thermal source. The filling component is disposed in the first accommodation space for limiting or avoiding the cooling liquid from immersing into the first accommodation space. The filling component is configured to limit or guide the cooling liquid from passing through the thermal source region, and the cooling liquid is configured to exchange a thermal with the thermal source region.