Guided Wave Thickness Measurement with Dual-Mode Transducers
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Solution Overview
Problem
Existing methods for measuring the thickness of elongate structures like pipes or plates using guided waves are complex, costly, and often require separate thickness gauges, which increase operational complexity and cost, while existing guided wave testing provides only qualitative information about defects.
Innovation Solution
A guided wave system with dual sets of transducers that operate in both guided wave testing and thickness measurement modes, using a broad frequency range to excite multiple dispersive modes, and a masking process to determine thickness by comparing frequency-domain signals with artificially-generated reference signals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a separate thickness gauge is used to measure structure thickness, then thickness measurement capability is improved, but device complexity and cost increase
Solution Approach 1:
The patent combines thickness measurement capability with guided wave testing functionality into a single integrated system. The same transducers used for guided wave testing are employed to measure thickness by analyzing reflected wave signals, eliminating the need for separate thickness gauges and reducing overall device complexity.
Solution Approach 2:
The guided wave testing system is designed to perform multiple functions: both defect detection through guided wave analysis and thickness measurement through reflected wave analysis. This multi-functionality allows a single device to replace multiple specialized tools, reducing cost and operational complexity.
2Length of stationary object
If guided wave testing is used to inspect structures, then inspection capability over long ranges is improved, but measurement information remains qualitative only
Solution Approach 1:
The patent uses reflected wave signals as an intermediary to extract quantitative thickness information from guided wave testing. By analyzing the timing and characteristics of reflected waves from the far end of the structure, the system converts qualitative inspection data into quantitative thickness measurements while maintaining long-range inspection capability.
3Device complexity
If single guided wave mode is used for thickness measurement, then measurement process is simplified, but noise robustness and resolution are reduced
Solution Approach 1:
The patent segments the measurement process into multiple independent components: excitation of multiple guided wave modes, separate analysis of each mode's reflected signals, and combination of results. This segmentation allows the system to maintain noise robustness by analyzing multiple modes while keeping the overall process manageable through systematic processing.
Solution Approach 2:
The system uses a composite approach by combining information from multiple guided wave modes to create a more reliable thickness measurement. Just as composite materials combine different materials to achieve superior properties, this method combines multiple wave modes to achieve superior noise robustness and measurement resolution.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate and efficient thickness measurement of elongate structures by leveraging multiple guided wave modes, reducing reliance on single modes, enhancing noise robustness, and improving resolution beyond frequency bin size, thus simplifying the process and reducing costs.
Implementation Method 1
determining a thickness of an elongate or extended structure, such as a wall of a pipe or a plate, using elastic guided waves
Data Source
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AI summary
A guided wave system is disclosed. The system is configured, in a first mode of operation, to perform guided wave testing of an elongate or extended structure and, in a second mode of operation, to measure thickness of the elongate or extended structure.