Guiding Jig Alignment for In-Place Circuit Board Testing
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Solution Overview
Problem
Existing circuit board testing processes are inefficient due to the difficulty in aligning probes with test points after the board is assembled into a mechanism element, leading to reduced yield and inflexible production arrangements.
Innovation Solution
A jig module with a guiding jig that includes a platform and alignment structures, allowing alignment of the jig with the mechanism element and circuit board in multiple directions, enabling probes to be inserted through aligned holes to contact test points within the mechanism element.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the circuit board is assembled into the mechanism element before testing, then the production process efficiency is improved, but the alignment difficulty between probe and test point increases due to reduced empty space and increased travel distance
Solution Approach 1:
The patent applies preliminary action by pre-positioning the circuit board onto the platform within the mechanism element before testing. The platform is designed with through holes at predetermined locations that correspond to test points, allowing the board to be fixed in advance. This enables the testing process to proceed without requiring complex real-time alignment adjustments, thus improving productivity while maintaining measurement precision through the pre-established geometric relationships.
Solution Approach 2:
The patent introduces a platform as an intermediary component between the circuit board and the testing system. This platform serves as a mediator that provides a stable reference frame with precisely positioned through holes. The circuit board is mounted on this platform, which then interfaces with the probe testing system. This intermediary structure eliminates the need for direct complex alignment between the probe and the circuit board test points, resolving the contradiction between assembly integration and alignment accuracy.
2Measurement precision
If the circuit board is tested outside the mechanism element on a jig stage, then the alignment between probe and test point is easier, but the production process becomes restrictive and inefficient
Solution Approach 1:
The patent implements the nesting principle by placing the platform with circuit board inside the mechanism element structure. The platform is nested within the mechanism element's internal space, and the through holes in the platform are positioned to align with test points on the circuit board. This nested arrangement allows testing to occur within the final product structure, eliminating the need for separate external jig stages and enabling more flexible and efficient production workflows.
Solution Approach 2:
The patent applies dimensionality change by utilizing the vertical dimension (travel direction) to enable probe access. Instead of requiring lateral alignment adjustments in the horizontal plane, the probe can approach the test points vertically through the through holes in the platform. This dimensional shift simplifies the alignment process while allowing the circuit board to remain integrated within the mechanism element, thereby improving both measurement precision and productivity.
3Adaptability or versatility
If the probe travel distance is increased to reach test points inside the mechanism element, then the circuit board can be tested in-place, but the alignment difficulty and complexity increase
Solution Approach 1:
The patent applies asymmetry in the design of the platform and its through holes. The through holes are positioned asymmetrically according to the specific test point locations on the circuit board, rather than using a symmetric grid pattern. This asymmetric arrangement optimizes the probe travel paths, allowing direct vertical access to each test point through specifically positioned holes. This reduces alignment complexity while maintaining in-place testing capability, as each through hole is strategically placed to minimize probe travel distance and maximize alignment ease.
Data Source
AI summary
A jig module and circuit board testing method using thereof are provided. The jig module includes a guiding jig. The guiding jig is disposed inside a mechanism element along a travel direction, and a circuit board is disposed inside the mechanism element. The guiding jig includes a platform, a first alignment structure, and a second alignment structure. The platform has a top and a bottom, and the platform includes a plurality of through holes penetrating the top surface and the bottom surface. When the guiding jig is disposed inside the mechanism element, the first alignment structure aligns with the mechanical component along a first direction and a second direction, and the second alignment structure aligns with the circuit board along a third direction, such that the plurality of through holes can be aligned with a plurality of test points on the circuit board.