Guiding Structure Fins for Wireless Interconnect Cross-Talk Reduction
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Solution Overview
Problem
High-frequency wireless interconnects in semiconductor packages face challenges with cross-talk and interference due to the close proximity of antennas, which can lead to reduced data transfer rates and increased complexity in design, particularly as data rates increase and mechanical and thermal assembly requirements are compromised by bulky flexible connector cables.
Innovation Solution
The implementation of a guiding structure with fins that confines wireless signals along specific pathways, preventing cross-talk and interference, and the use of phase-shifted signals to achieve constructive or destructive interference, allowing for high data transfer rates without increasing antenna separation or splitting bandwidth.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If antennas are placed in close proximity to increase I/O density, then device integration is improved, but cross-talk and interference between wireless interconnects increases
Solution Approach 1:
A guiding structure is introduced as an intermediary element between adjacent antennas. This structure includes a first portion extending from a first antenna and a second portion extending from a second antenna, with the portions positioned adjacent to each other to provide signal confinement. The guiding structure acts as a mediator that prevents direct electromagnetic interference between antennas while maintaining their close proximity for high I/O density.
Solution Approach 2:
The guiding structure is segmented into multiple portions, with each portion associated with a specific antenna. These segmented portions can be independently configured and positioned to optimize signal confinement for each wireless interconnect pair, allowing the system to maintain high antenna density while managing cross-talk through localized guidance structures.
2Device complexity
If flexible connector cables are used to connect packages directly, then signal path is simplified, but mechanical and thermal assembly requirements are compromised due to bulky cables
Solution Approach 1:
The patent replaces the mechanical flexible connector cable system with an electromagnetic field-based wireless communication system. Instead of using physical cables to transmit signals between packages, the invention uses wireless interconnects with guiding structures that confine electromagnetic signals, eliminating the need for bulky mechanical cables while maintaining simplified signal paths.
3Reliability
If antenna separation is increased to reduce cross-talk, then signal fidelity is improved, but device area and integration density deteriorate
Solution Approach 1:
The guiding structure serves as an intermediary that enables high signal fidelity without requiring increased antenna separation. By introducing this confining structure between antennas, the system achieves reliable signal transmission while maintaining compact antenna spacing, thus avoiding the need to increase device area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces cross-talk and interference, enabling high data transfer rates with improved signal fidelity and thermal management, while maintaining a compact design that aligns with mechanical and thermal assembly requirements.
Implementation Method 1
a guiding structure with fins that confines wireless signals along specific pathways, preventing cross-talk and interference
Implementation Method 2
the use of phase-shifted signals to achieve constructive or destructive interference, allowing for high data transfer rates
Data Source
AI summary
Embodiments of the invention may include packaged device that may be used for reducing cross-talk between neighboring antennas. In an embodiment the packaged device may comprise a first package substrate that is mounted to a printed circuit board (PCB). A plurality of first antennas may also be formed on the first package. Embodiments may also include a second package substrate that is mounted to the PCB, and the second package substrate may include a second plurality of antennas. According to an embodiment, the cross-talk between the first and second plurality of antennas is reduced by forming a guiding structure between the first and second packages. In an embodiment the guiding structure comprises a plurality of fins that define a plurality of pathways between the first antennas and the second antennas.


