High Power Electronic Component With Gull-Wing Leadframe
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Solution Overview
Problem
Existing electronic components with semiconductor devices face challenges in efficiently redistributing electrical connections within the package housing, particularly for high-voltage devices, which can lead to interference currents and reduced performance due to the conventional drain-down arrangement.
Innovation Solution
The integration of a gull-wing shaped conductive element that couples the control electrode to the lead, providing an internal redistribution structure within the package housing, allowing for a source-down arrangement that reduces interference currents and enhances electrical coupling between the semiconductor die and the leadframe.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional drain-down arrangement is used for electrical connections, then the package structure is simple, but interference currents increase and performance decreases
Solution Approach 1:
The electrical connection structure is segmented into multiple separate leadframes (first leadframe, second leadframe, third leadframe) instead of using a single conventional drain-down arrangement. Each leadframe carries specific electrical connections (Gate, Drain, Source) separately, preventing interference currents between different electrical paths while maintaining standard pinning orders.
2Reliability
If internal redistribution structure is added to reduce interference currents, then performance improves, but device complexity increases
Solution Approach 1:
Multiple leadframes are merged and integrated within a single package housing, with each leadframe providing specific electrical connections. This combining approach achieves improved electrical coupling and reduced interference currents while keeping the overall package structure manageable and the pinning order standard-compliant.
Data Source
AI summary
In an embodiment an electronic component includes a semiconductor die having a first surface, the first surface including a first current electrode and a control electrode. The electronic component further includes a die pad having a first surface, a plurality of leads and a gull-wing shaped conductive element coupled to a first lead of the plurality of leads. The first current electrode is mounted on the die pad and the gull-wing shaped conductive element is coupled between the control electrode and the first lead.