Gullwing Foldable PCB for High Frequency SSD Signal Integrity

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Solution Overview

Problem

Current printed circuit boards (PCBs) in SSDs face challenges in accommodating increased host bandwidth and heat dissipation, with rigid structures limiting flexibility and component placement, leading to potential interference and reduced signal quality.

Innovation Solution

A foldable PCB design with a gullwing configuration featuring rigid and flexible regions, allowing for non-overlapping placement of components and improved heat dissipation, utilizing materials like polyimide and FR-4, and optimizing component positioning for reduced trace lengths and enhanced signal quality.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If a rigid PCB structure is used, then structural stability is improved, but flexibility and component placement freedom deteriorate

Engineering Contradiction:
Improvestructural stabilityVSAvoidflexibility and component placement freedom
Core Design Contradiction:
Stability of the object's compositionVSAdaptability or versatility

Solution Approach 1:

The PCB is segmented into multiple rigid portions (first rigid portion, second rigid portion, third rigid portion) connected by flexible regions. This segmentation allows each rigid portion to provide structural stability while the flexible regions provide the necessary flexibility and placement freedom, resolving the contradiction between stability and adaptability.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent uses flexible regions (acting as flexible films) to connect rigid portions of the PCB. These flexible regions enable the PCB to be folded into a gullwing configuration, providing both structural integrity through rigid portions and flexibility through the thin film connections, thus resolving the contradiction between rigidity and flexibility.

Inventive Principle:
Principle #30Flexible shells and thin films

2Speed

If components are placed closer together to increase bandwidth, then signal processing speed is improved, but interference between components increases

Engineering Contradiction:
Improvesignal processing speedVSAvoidinterference between components
Core Design Contradiction:
SpeedVSObject-affected harmful factors

Solution Approach 1:

The PCB is folded into a three-dimensional gullwing configuration, transitioning from a two-dimensional layout to a 3D structure. This dimensional change allows components to be positioned in space without overlapping, enabling shorter trace lengths and faster signal processing while maintaining adequate spacing to reduce interference between components.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The gullwing configuration allows the first and third rigid portions to be positioned over the second rigid portion in a nested arrangement. This nesting enables compact component placement for high-speed signaling while the vertical stacking reduces horizontal interference between components.

Inventive Principle:
Principle #7Nested doll (Nesting)

3Volume of moving object

If a compact PCB design is used, then enclosure space is reduced, but heat dissipation capability deteriorates

Engineering Contradiction:
Improveenclosure spaceVSAvoidheat dissipation capability
Core Design Contradiction:
Volume of moving objectVSTemperature

Solution Approach 1:

By folding the PCB into a gullwing configuration, the design utilizes the vertical dimension within the enclosure rather than only horizontal space. This 3D arrangement reduces the enclosure footprint while creating vertical spacing between components and the enclosure bottom, facilitating improved heat dissipation pathways.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The segmented rigid portions connected by flexible regions create natural spacing and air gaps within the compact structure. These gaps, particularly between the stacked rigid portions in the gullwing configuration, provide thermal pathways for heat dissipation while maintaining a compact overall volume.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS10405420B2Gullwing PCB structure to enable high frequency operation
Publication Date: 2019.09.03 INTEL CORP
  • US10405420B2 patent drawing
  • US10405420B2 patent drawing
  • US10405420B2 patent drawing

AI summary

Embodiments include devices and method related to a foldable printed circuit board that may be used in SSD applications. One embodiment relates to a foldable printed circuit board comprising a first rigid portion, a second rigid portion, and a first flexible region coupling the first rigid portion to the second rigid portion. The foldable printed circuit board also includes a third rigid portion and a second flexible region coupling the second rigid portion to the third rigid portion, wherein the first rigid portion and the third rigid portion each have a width that is less than that of the second rigid portion. Other embodiments are described and claimed.