Vibrating Gyro Sensor Thickness Reduction via Lead Wire Elimination
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Solution Overview
Problem
Existing motion sensors face challenges in reducing thickness due to the need for space to accommodate bent lead wires, which increases the overall thickness and complexity of the sensor device.
Innovation Solution
A sensor device configuration that includes a semiconductor substrate with a stress relief layer between the semiconductor substrate and the external connection terminal, allowing direct electrical connection without lead wires, and a rearrangement wiring line for flexible terminal positioning, enabling a thinner design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If lead wires are made elastic to absorb impact, then reliability is improved, but device thickness increases
Solution Approach 1:
The patent extracts the lead wire from the sensor device structure entirely. Instead of using elastic lead wires to absorb impact, the invention connects the sensor element directly to the semiconductor substrate through bonding pads, eliminating the need for lead wires and thus reducing device thickness while maintaining reliability through direct rigid connection.
Solution Approach 2:
The patent applies beforehand cushioning by providing a gap between the sensor element and semiconductor substrate, and using bonding pads that can accommodate stress. This gap acts as a cushioning space that prevents direct transmission of impact forces to the sensor element, while the bonding pads provide stress relief without requiring elastic lead wires.
2Reliability
If space is provided for lead wire bending, then reliability is improved, but device thickness increases
Solution Approach 1:
The patent removes the lead wire component entirely from the sensor device. The sensor element is directly bonded to the semiconductor substrate through bonding pads, eliminating the need for space required for lead wire bending and connection, thereby reducing device thickness while maintaining electrical connection reliability.
Solution Approach 2:
The patent provides a predetermined gap between the sensor element and semiconductor substrate that serves as a cushioning space. This gap allows for stress relief and impact absorption without requiring additional space for lead wire bending, as the direct bonding structure eliminates the need for flexible connection elements.
3Length of stationary object
If direct connection without lead wires is used, then device thickness is reduced, but stress relief capability is worsened
Solution Approach 1:
The patent introduces bonding pads as intermediary elements between the sensor element and semiconductor substrate. These bonding pads serve as stress relief mechanisms that can deform or flex to absorb stress, while the direct bonding structure maintains compact device thickness. The bonding pads act as mediators that protect the sensor element from direct stress transmission.
Solution Approach 2:
The patent provides a gap between the sensor element and semiconductor substrate that serves as a cushioning space. This gap allows for stress relief and impact absorption in the direct connection structure, compensating for the lack of elastic lead wires while maintaining reduced device thickness.
Data Source
Figure 1A~1B
Figure 2
Figure 3
AI summary
A sensor device 1 includes: a silicon substrate 10; a first electrode 11 provided at an active surface 10a side of the silicon substrate 10; an external connection terminal 12 provided at the active surface 10a side so as to be electrically connected to the first electrode 11; a stress relief layer 15 provided between the silicon substrate 10 and the external connection terminal 12; and a vibrating gyro element 20 as a sensor element including a extraction electrode 29. The vibrating gyro element 20 is held to the silicon substrate 10 by connection between the extraction electrode 29 and the external connection terminal 12.