Gyroscope Packaging Assembly Thermal Stress Reduction
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Solution Overview
Problem
Conventional planar resonator gyroscopes face issues with thermal expansion differentials, mechanical stress, warpage, and capacitive gap nonuniformity due to dissimilar materials in MEMS packaging, leading to sensing errors and drift, particularly in spacecraft applications where compact, lightweight, and cost-effective solutions are needed.
Innovation Solution
A packaging method for planar resonator gyroscopes that involves a carrier, substrate, and baseplate to create a cavity for the resonator, using materials like silicon and quartz, with electrical interconnects and a cap to secure the assembly, and incorporating active thermal management elements to minimize thermal and physical stress, while maintaining compatibility with existing manufacturing techniques.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If dissimilar materials are used in MEMS packaging, then manufacturing flexibility and electrical connectivity are improved, but thermal expansion differentials cause mechanical stress, warpage, and capacitive gap nonuniformity
Solution Approach 1:
The patent applies homogeneity by using the same material (silicon) for both the MEMS die and package substrate. This eliminates thermal expansion differentials between dissimilar materials, preventing mechanical stress, warpage, and capacitive gap nonuniformity that would otherwise occur during temperature cycling and operation.
Solution Approach 2:
The patent employs composite material structures where silicon-based materials are used throughout the packaging assembly. The silicon MEMS die is mounted on a silicon package substrate, which is then attached to a silicon carrier, creating a homogeneous silicon-silicon interface that eliminates thermal mismatch problems.
2Reliability
If conventional MEMS packaging techniques are used, then electrical connectivity and structural support are achieved, but thermal gradients induce capacitive gap nonuniformity and sensing errors
Solution Approach 1:
The patent eliminates thermal gradients by using homogeneous silicon materials throughout the packaging structure. The silicon package substrate and silicon carrier have matched thermal expansion coefficients, ensuring uniform temperature distribution and preventing capacitive gap nonuniformity that would degrade sensing accuracy.
Solution Approach 2:
The silicon package substrate acts as an intermediary between the silicon MEMS die and the silicon carrier. This intermediate layer provides thermal management and mechanical support while maintaining material compatibility, preventing thermal stress transmission that would affect sensing elements.
3Weight of moving object
If compact packaging is implemented, then device size and weight are reduced, but thermal management challenges increase
Solution Approach 1:
The homogeneous silicon construction enables efficient thermal conduction throughout the compact package. The silicon carrier and substrate provide thermal pathways that conduct heat away from the MEMS die, maintaining uniform temperature distribution despite the reduced device size and improved weight characteristics.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the physical and thermal stability of the gyroscope package, reducing sensing errors and drift, and allows for more efficient manufacturing of compact, lightweight, and cost-effective inertial sensors suitable for spacecraft applications.
Implementation Method 1
A packaging method for planar resonator gyroscopes that involves a carrier, substrate, and baseplate to create a cavity for the resonator... incorporating active thermal management elements to minimize thermal and physical stress
Data Source
Figure 1A~1B
Figure 1C~1D
Figure 2A
AI summary
Packaging techniques for planar resonator gyroscopes, such as disc resonator gyroscopes (DRGs) are disclosed. In one embodiment, a packaged resonator gyroscope comprises a carrier, a substrate layer mounted to the carrier, a baseplate coupled to the substrate to define a cavity between the substrate and the baseplate, and a resonator mounted to the baseplate and suspended in the cavity. Other embodiments may be described.