H-Section Support Profile for Vacuum Insulated Panel Mounting

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Solution Overview

Problem

Existing thermal insulation systems using PIV panels face challenges with fragile barrier envelopes, complex assembly requirements, and inefficiencies in minimizing thermal bridges and maintaining airtightness, particularly when using standard manufacturing panels.

Innovation Solution

A mounting and fixing kit with a support profile having an H-section and bracing devices that allow for flexible adjustment and secure attachment of PIV panels, using non-metallic materials with low thermal conductivity to minimize heat transfer and maintain the integrity of the vacuum insulation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If PIV panels with thin barrier envelopes are used to achieve low thermal conductivity, then thermal insulation performance is improved, but the panels become fragile and sensitive to compressive or bending forces

Engineering Contradiction:
Improvethermal conductivityVSAvoidfragility of barrier envelope
Core Design Contradiction:
Loss of energyVSReliability

Solution Approach 1:

The system divides the insulation function into separate components: the PIV panels provide thermal insulation while the H-section support profile provides mechanical support. This segmentation allows each component to be optimized for its specific function without compromise.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The H-section support profile acts as an intermediary between the wall and the PIV panels, bearing the mechanical loads and transferring them to the wall, thereby protecting the fragile barrier envelope from compressive and bending forces.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Loss of energy

If large-sized PIV panels are used to reduce the number of joints and improve thermal performance, then thermal insulation performance is improved, but the complexity of ensuring airtightness and minimizing thermal bridges at junctions increases

Engineering Contradiction:
Improvethermal insulation performanceVSAvoidcomplexity of assembly and airtightness
Core Design Contradiction:
Loss of energyVSDevice complexity

Solution Approach 1:

The H-section support profile serves multiple functions simultaneously: it provides mechanical support for the panels, ensures airtightness at junctions through its sealing lips, minimizes thermal bridges with its low thermal conductivity material, and simplifies assembly with its standardized design.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Loss of energy

If complex H-section support profiles are used to minimize thermal bridges and ensure airtightness, then thermal insulation performance is improved, but the complexity of the assembly process and adjustment flexibility decreases

Engineering Contradiction:
Improvethermal bridge minimizationVSAvoidassembly flexibility
Core Design Contradiction:
Loss of energyVSEase of operation

Solution Approach 1:

The support profile incorporates adjustable elements such as movable sealing lips and adaptable bracing device positions, allowing the system to be adjusted during assembly to accommodate manufacturing tolerances and site conditions while maintaining thermal performance.

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables efficient and flexible assembly of PIV panels with reduced thermal bridges and airtightness, preserving the insulation performance close to that of individual panels, while allowing for easy adjustment and cost-effective use of standard manufacturing panels.

Implementation Method 1

an insulating porous core material with a micro-cellular or nano-cellular structure with open cells) maintained under vacuum

Methodology Applied
Scientific EffectVacuum: Vacuum

Implementation Method 2

The thermal performance of these elementary panels leads to thicknesses which can be reduced to minimize the size of the thermal insulation system

Methodology Applied
Scientific EffectThermal insulation: Thermal Insulation

Implementation Method 3

a barrier envelope guaranteeing gas tightness

Methodology Applied
Scientific EffectGas barrier: Semipermeable Membrane

Implementation Method 4

materials having, at ambient temperature, a thermal conductivity level of less than 25 mW m -1

Methodology Applied
Scientific EffectThermal conductivity: Conduction (thermal)

Data Source

PatentEP2959073B1Attachment kit suitable for holding vip's, and associated method and system for lining a wall
Publication Date: 2019.08.07 ELECTRICITE DE FRANCE
  • EP2959073B1 patent drawingFigure 1
  • EP2959073B1 patent drawingFigure 2~3
  • EP2959073B1 patent drawingFigure 4A~5

AI summary

The system for lining a wall can incorporate a layer of vacuum insulated panels (3) at a supporting profiled section (10) having an H-shaped section . An anchoring device (15) rigidly connected to the front branch (10b) of this profiled section (10) serves to attach the rear end (20a) of one or a plurality of spacing devices (20). The latter have a front end (20b) provided with a holding element (40) connecting to the profiled sections (5) of the secondary framework of the system. The profiled section (10), which has, on the rear branch (10a) of same, a bearing face that can be attached to the wall, makes it possible to take up the bearing forces transmitted from an outer cladding to each of the devices (20). During assembly, the spacing element (30) of a device (20) can be moved in translation and blocked by one of the holding element (40) and an opposing attachment member (22) in contact with the anchoring device (15).