Hafnium Precursor Design for Low Melting Point Vapor Deposition

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Solution Overview

Problem

There is a need for Hafnium precursor molecules that are liquid or have a low melting point, high thermal stability, low viscosity, and suitable for vapor phase thin film deposition with controlled thickness and composition at high temperatures, to address the requirements of advanced semiconductor devices.

Innovation Solution

The development of Hafnium-containing film forming compositions comprising Silicon- and Hafnium-containing precursors with specific formulas, such as (trimethylsilyl)cyclopentadienyl tris(Dimethylamino) Hafnium(IV) and (trimethylsilyl)cyclopentadienyl tris(alkoxy) Hafnium(IV), which are synthesized and used for depositing Hafnium-containing films on substrates via vapor deposition processes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If conventional Hafnium precursors are used, then film deposition can be achieved, but the precursors have high melting points and poor thermal stability

Engineering Contradiction:
Improvemelting pointVSAvoidthermal stability
Core Design Contradiction:
TemperatureVSReliability

Solution Approach 1:

The patent modifies the chemical structure of Hafnium precursors by replacing conventional ligands with silylcyclopentadienyl ligands. This structural parameter change results in precursors with lower melting points and enhanced thermal stability, enabling vapor phase deposition at controlled temperatures while maintaining precursor stability.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The invention creates composite molecular structures combining Hafnium centers with silylcyclopentadienyl ligand systems. These composite precursor molecules exhibit synergistic properties where the silylcyclopentadienyl component provides thermal stability and low melting point characteristics, while the Hafnium center enables film formation.

Inventive Principle:
Principle #40Composite materials

2Manufacturing precision

If high temperature vapor deposition is used, then film quality improves, but precursor decomposition occurs

Engineering Contradiction:
Improvefilm qualityVSAvoidprecursor stability
Core Design Contradiction:
Manufacturing precisionVSStability of the object's composition

Solution Approach 1:

The patent optimizes the thermal parameters of the deposition process by using precursors with enhanced thermal stability. This allows operation at elevated temperatures that improve film quality and uniformity while the modified precursor structure prevents decomposition, maintaining compositional stability throughout the process.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The invention uses precursors designed to be stable during the deposition process but decompose cleanly after delivering their metal content. The silylcyclopentadienyl ligands provide temporary stability during handling and deposition, then decompose at controlled rates to form high-quality films without contaminating residues.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

3Manufacturing precision

If precursor viscosity is reduced for better deposition, then film uniformity improves, but precursor stability decreases

Engineering Contradiction:
Improvefilm uniformityVSAvoidprecursor stability
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The patent modifies the physical parameters of the precursor by introducing silylcyclopentadienyl ligands with specific alkyl substitutions. These structural changes reduce molecular packing efficiency and intermolecular interactions, lowering viscosity to improve film uniformity while the steric bulk of the ligands maintains thermal and chemical stability.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

These compositions enable the deposition of Hafnium films with high purity and controlled properties, enhancing the performance of semiconductor devices by providing stable and uniform thin films with precise composition and thickness control.

Implementation Method 1

used for depositing Hafnium-containing films on substrates via vapor deposition processes

Methodology Applied
Scientific EffectVapor deposition: Physical Vapour Deposition

Implementation Method 2

Hafnium precursor molecules that are liquid or have a low melting point... suitable for vapor phase thin film deposition

Methodology Applied
Scientific EffectEvaporation: Evaporation

Data Source

PatentUS10106568B2Hafnium-containing film forming compositions for vapor deposition of hafnium-containing films
Publication Date: 2018.10.23 LAIR LIQUIDE SA POUR LETUDE & LEXPLOITATION DES PROCEDES GEORGES CLAUDE
  • US10106568B2 patent drawing
  • US10106568B2 patent drawing
  • US10106568B2 patent drawing

AI summary

Disclosed are Hafnium-containing film forming compositions comprising Silicon- and Hafnium-containing precursors having one of the following formula:wherein each R1, R2, R3, R4, R5, R6, R7, R8, R9 and R10 is independently selected from H; a C1-C5 linear, branched, or cyclic alkyl group; or a C1-C5 linear, branched, or cyclic fluoroalkyl group. Also disclosed are methods of synthesizing the disclosed compositions and using the same to deposit Hafnium-containing thin films on substrates via vapor deposition processes.