Half-Bridge Busbar Layout for Compact Low-Inductance Inverters

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Solution Overview

Problem

Existing power inverters and half-bridge modules are not reliably and cost-effectively produced, necessitating improvements in their design and manufacturing processes.

Innovation Solution

A power half-bridge module design featuring a busbar carrier with embedded busbars and recesses, combined with a semiconductor carrier and control circuits, allowing for a compact, reliable, and cost-effective construction.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional power inverter designs are used, then basic functionality is achieved, but reliability and production cost-effectiveness are insufficient

Engineering Contradiction:

ImprovereliabilityVSAvoidproduction cost-effectiveness

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent combines the busbar carrier and semiconductor carrier into a single integrated module housing, merging multiple components that were previously separate. This integration improves reliability by reducing connection points and assembly steps, while simultaneously improving production cost-effectiveness through streamlined manufacturing and reduced assembly complexity.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The busbar carrier serves multiple functions: it provides electrical connections, structural support, and mounting for semiconductor components. This multi-functionality reduces the number of separate components needed, improving both reliability through fewer parts and production cost-effectiveness through simplified manufacturing.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Volume of moving object

If compact design is implemented, then space efficiency improves, but heat dissipation and electrical connection quality may deteriorate

Engineering Contradiction:

Improvemodule sizeVSAvoidheat dissipation

Core Design Contradiction:

Volume of moving objectVSTemperature

Solution Approach 1:

The patent utilizes three-dimensional space efficiently by arranging busbars and semiconductor carriers in multiple layers and orientations within the compact housing. The busbar carrier extends in multiple dimensions with exposed contact areas on different surfaces, allowing compact packaging while maintaining adequate thermal pathways and electrical connection quality through strategic spatial arrangement.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The design nests the semiconductor carrier within the busbar carrier structure, with semiconductor devices mounted on the busbar carrier's surfaces and protruding into recesses. This nested arrangement achieves compact overall dimensions while maintaining proper spacing for heat dissipation and electrical connections through hierarchical component placement.

Inventive Principle:

Principle #7Nested doll (Nesting)

3Reliability

If complex assembly structures are used, then connection quality improves, but manufacturing complexity and cost increase

Engineering Contradiction:

Improveelectrical connection qualityVSAvoidassembly structure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The busbar carrier is pre-formed with integrated recesses, exposed contact areas, and mounting structures before final assembly. The semiconductor carrier is also pre-prepared with mounted devices. These preliminary preparations enable simple, reliable final assembly while maintaining high connection quality, reducing both manufacturing complexity and cost.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The busbar carrier's exposed contact areas and recesses are designed to automatically align and interface with corresponding features on the semiconductor carrier during assembly. This self-aligning design reduces the need for complex positioning mechanisms and adjustment steps, simplifying manufacturing while ensuring reliable electrical connections.

Inventive Principle:

Principle #25Self-service

Data Source

PatentUS12500211B2Power half-bridge module, power inverter, and method for producing a power half-bridge module

Publication Date: 2025.12.16 VITESCO TECH GERMANY GMBH

AI summary

A power half-bridge module may include: a busbar carrier with insulation embedding a first busbar with two longitudinal sections; a semiconductor carrier with a second busbar and a third busbar in a row in the longitudinal direction of the busbar carrier; a first semiconductor switch with a lower-side load-current contact area on the second busbar; and a second semiconductor switch with a lower-side load-current contact area on the third busbar. The first busbar has a contact area on the first section and a second contact area on the second section. The busbar carrier has a recess at the height of the second section and extending from one surface to another. The semiconductor carrier is arranged on the second surface of the busbar carrier so both switches protrude into the recess. The second switch has an upper-side load-current contact area electrically connected to the second contact area of the first busbar.