Half Bridge Clip Support Structure to Prevent Package Tilting
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Solution Overview
Problem
Half bridge bond clips in semiconductor packages are prone to tilting during manufacturing, leading to unreliable or malfunctioning packages, which complicates testing and increases costs.
Innovation Solution
A semiconductor package design incorporating a half bridge clip with conductive elements that are electrically and mechanically connected to die paddles, providing mechanical stabilization and electrical connectivity, thereby preventing tilting and ensuring stable package assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If bond clips are used to handle greater current, then current capacity is improved, but the risk of tilting during manufacturing increases due to heavier weight
Solution Approach 1:
The patent introduces a support structure (mold support or die paddle support) that acts as a counterweight system to balance the heavy bond clip during molding. The support extends into the mold cavity and provides mechanical support to the bond clip, preventing tilting while allowing the bond clip to maintain its heavy construction for high current capacity.
Solution Approach 2:
The patent introduces an intermediary support structure between the mold and the bond clip. This support (comprising support elements that extend into the mold cavity) mediates the interaction between the heavy bond clip and the molding process, preventing direct contact that would cause tilting while still allowing the bond clip to function as intended.
2Power
If bond clips are used to handle greater current, then current capacity is improved, but manufacturing cost increases due to additional testing requirements
Solution Approach 1:
The patent implements preliminary action by providing mechanical support to the bond clip during the molding process itself. This prevents tilting at the source during manufacturing, eliminating the need for subsequent costly testing and rework. The support structure is integrated into the molding process, addressing the problem before it can manifest as defects requiring expensive testing.
3Power
If bond clips are used to handle greater current, then current capacity is improved, but detection of tilting errors becomes more difficult during molding
Solution Approach 1:
The patent implements feedback by making the bond clip support visible or detectable during the molding process. The support structure is designed to be observable, allowing real-time detection of any tilting or positioning issues. This immediate feedback mechanism enables operators to identify problems during manufacturing rather than discovering them later during testing.
Data Source
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AI summary
A semiconductor package comprising a first and at least one further semiconductor device positioned at an interspacing from each other. Each of the semiconductor devices comprises a die paddle having a semiconductor die region, and a stacked semiconductor device having a first surface and a second surface opposite to the first surface, wherein the first surface is mounted to the semiconductor die region. The semiconductor package further comprises a half bridge clip having a first bridge clip portion electrically and mechanically connected to the second surface of the first semiconductor device and a further bridge clip portion electrically and mechanically connected to the second surface of the at least one further semiconductor device, wherein the half bridge clip comprises at least one conductive element electrically and mechanically connecting to at least one of the die paddles of the first and the at least one further semiconductor device.