Scalable Half-Bridge Power Module Layout With Multilayer Clips
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Solution Overview
Problem
Existing power modules with half-bridge topology face challenges in layout complexity, parasitic inductances, and limited scalability due to design constraints, which hinder efficient use of space and adaptability in applications such as inverters and motor drive devices.
Innovation Solution
The power module employs a substrate with a multilayer structure and specifically designed clips to reduce parasitic inductances and enhance scalability, allowing for efficient thermal dissipation and compact design while maintaining high electric efficiency and adaptability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional leadframe-based substrate layout is used, then electrical connections can be established, but parasitic inductances increase and layout complexity increases
Solution Approach 1:
The substrate is divided into multiple isolated conductive regions (first conductive region, second conductive region, third conductive region) that are electrically insulated from each other. This segmentation allows independent optimization of each region's function, reducing unwanted electromagnetic coupling and parasitic inductances while maintaining reliable electrical connections to respective terminals.
Solution Approach 2:
The insulating layer acts as an intermediary between the conductive regions, providing electrical isolation while allowing thermal conduction. This mediator enables the conductive regions to be positioned closer together without increasing parasitic inductances, as the insulating layer prevents electromagnetic coupling while maintaining structural integrity.
2Reliability
If clearance isolation distances are maintained, then electrical safety is ensured, but available space for component placement is reduced
Solution Approach 1:
The patent transitions from planar clearance-based isolation to three-dimensional isolation using an insulating layer with specific thickness. By adding the vertical dimension (insulating layer thickness), the design achieves electrical clearance without consuming additional horizontal substrate area, allowing more efficient space utilization for power devices and terminals.
Solution Approach 2:
The substrate employs a composite structure combining conductive regions with an insulating layer material that provides both electrical insulation and thermal conduction properties. This composite approach maintains clearance isolation distances while minimizing area consumption, as the insulating material allows closer positioning of conductive regions without compromising electrical safety.
3Adaptability or versatility
If modular substrate design is used, then adaptability to different applications is improved, but manufacturing complexity increases
Solution Approach 1:
The substrate design provides universal adaptability by incorporating multiple isolated conductive regions that can be configured for different terminal arrangements (e.g., DC+, DC-, switching terminals). The same basic substrate structure with insulating layer can serve various power module applications by simply changing the connection configuration, eliminating the need for multiple specialized substrate designs and simplifying manufacturing.
Data Source
Figure 1~3
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Figure 6~7
AI summary
Power module (2) having a support (35); a first control contact area (36B) on the support; a second control contact area (36C) on the support; a first electronic power device (28.1); a second electronic power device (28.2); a first clip (20); a second clip (21); a third clip (22); and a package (9) embedding the support, the first and the second electronic power devices as well as partially the first, the second and the third clips. The first electronic power device (28.1) has a first conduction pad (30) electrically coupled to the first clip (20); a second conduction pad (31) electrically coupled to the third clip (22) and a control pad (32) coupled to the first control contact area (36B). The second electronic power device (28.2) has a first conduction pad (30) electrically coupled to the third clip (22), a second conduction pad (31) electrically coupled to the second clip (21), and a control pad (32) coupled to the second control contact area (36C). The first and the second electronic power devices form a half-bridge circuit (1).