Half-Bridge Module Layout for Heat Dissipation and Current Sharing
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Solution Overview
Problem
Existing half-bridge modules for inverters in electric and hybrid vehicles face challenges with heat dissipation, current distribution, and installation space, where improved heat dissipation requires more space and even current distribution results in poorer heat dissipation, and vice versa.
Innovation Solution
A half-bridge module design featuring semiconductor switches electrically contacted via bond wires and lead frames, with signal connections accessed via bond wires and power connections via lead frames, allowing for flexible arrangement and optimized current distribution, heat dissipation, and reduced installation space without degrading other properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the semiconductor switches are arranged to improve heat dissipation, then heat dissipation is improved, but installation space increases
Solution Approach 1:
The patent transitions from planar arrangement of semiconductor switches to a three-dimensional stacked configuration on the substrate. Multiple semiconductor switches are arranged in different layers/levels on the substrate, utilizing vertical space rather than only horizontal space. This dimensional change allows improved heat dissipation through better thermal pathways while maintaining compact installation footprint.
2Reliability
If the semiconductor switches are arranged to achieve even current distribution, then current distribution is improved, but heat dissipation deteriorates
Solution Approach 1:
The patent implements different connection types (bond wires and lead frames) for different semiconductor switches or different connection points on the same switch. This local differentiation allows optimization of current distribution for switches requiring even current sharing, while other switches can be configured for optimal heat dissipation. The mixed connection approach enables localized tailoring of electrical and thermal characteristics.
3Ease of manufacture
If bond wires are used for all electrical contacts, then manufacturing flexibility is improved, but current distribution becomes uneven
Solution Approach 1:
The patent combines two different electrical connection technologies - bond wires and lead frames - within the same half-bridge module. Bond wires provide manufacturing flexibility and ease of connection, while lead frames provide superior current distribution characteristics. By merging these two connection types, the module achieves both manufacturing advantages and reliable current distribution that neither connection type could provide alone.
4Reliability
If lead frames are used for all electrical contacts, then current distribution is improved, but manufacturing complexity increases
Solution Approach 1:
Instead of using lead frames for all electrical contacts throughout the module, the patent applies lead frames selectively - only where they provide necessary current distribution benefits. Bond wires are used for connections where their simplicity suffices. This partial application of the more complex lead frame technology reduces overall manufacturing complexity while still achieving reliable current distribution where critical.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves low leakage inductance and switching losses, enabling efficient power transfer with flexible semiconductor switch arrangement, improved heat dissipation, and reduced installation space requirements, balancing current distribution, heat dissipation, and space needs.
Implementation Method 1
the semiconductor switches are electrically contacted in part via bond wires and in part via lead frames
Data Source
AI summary
The invention relates to a half-bridge module for an inverter in an electric drive for an electric vehicle or a hybrid vehicle, comprising a substrate, semiconductor switches arranged on the substrate, power connections, and signal connections, wherein the signal connections are electrically connected to the semiconductor switches such that the semiconductor switches can be switched via the signal connections, and wherein the power connections are electrically connected to the semiconductor switches such that the semiconductor switches allow or interrupt electricity transmission between the power connections. The half-bridge module according to the invention is distinguished in that the semiconductor switches are in electrical contact in part via bond wires and in part via lead frames. The invention also relates to a corresponding inverter.