Half-Bridge Lead Frame Layout for Low-Inductance Inverters
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Solution Overview
Problem
Existing DC-AC power inverters for aircraft are limited by high inductance in half-bridge modules, which affects performance and efficiency, particularly in electrically-powered aircraft where space, weight, and heat management are critical.
Innovation Solution
A novel package and lead frame configuration for a half-bridge module is introduced, where the leads connecting each side of the half-bridge to the DC power source are adjacent and parallel, reducing the area circumscribed by the leads and thus minimizing inductance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional lead frame configuration is used in half-bridge modules, then manufacturing is simpler, but inductance is high which reduces inverter performance
Solution Approach 1:
The patent transitions from conventional non-parallel lead arrangements to an adjacent parallel configuration, utilizing spatial dimension optimization to minimize the area circumscribed by leads. This dimensional reconfiguration reduces inductance by positioning power leads side-by-side rather than in series or offset positions, directly addressing the inductance-performance contradiction.
Solution Approach 2:
The invention changes the geometric parameters of the lead frame configuration by positioning leads in adjacent parallel relationships. This parameter modification—specifically the spatial arrangement and orientation of leads—directly reduces the loop area and consequently the inductance, improving inverter performance without fundamental redesign of the entire package.
2Reliability
If lead area is reduced to minimize inductance, then inverter performance improves, but manufacturing precision requirements increase
Solution Approach 1:
The patent incorporates lead alignment features and positioning structures during the lead frame fabrication process itself, establishing precise parallel relationships before final assembly. This preliminary action of pre-positioning and securing leads in their correct adjacent parallel configuration during manufacturing reduces the need for high-precision alignment during subsequent assembly operations.
3Use of energy by moving object
If half-bridge modules with reduced inductance are used, then power conversion efficiency improves, but heat generation management becomes more critical
Solution Approach 1:
The patent extracts and addresses the heat management challenge as a separate consideration from the inductance reduction. By successfully reducing inductance through lead configuration, the system achieves improved power conversion efficiency, while the resulting thermal management requirements are handled as a distinct design parameter through appropriate cooling solutions and thermal design.
Data Source
AI summary
A half-bridge package for a power inverter comprises a first switch and a first lead coupled to the first switch, and a second switch and a second lead coupled to the second switch, wherein the first lead and the second lead are adjacent to one another. At least one of the first switch and the second switch are formed on a die, and the half-bridge package may further comprise a thermistor mounted to the die. In some examples the thermistor is sintered to the die.