Half-Bridge Power Module Layout for Low-Inductance High Current
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Solution Overview
Problem
High power applications require compact, high voltage, and low inductance power modules that efficiently handle high currents while maintaining performance across various power processing needs, but existing solutions struggle with scalability and modularity, leading to inefficiencies in power handling and thermal management.
Innovation Solution
A compact, high voltage, high current, low inductance half-bridge power module design featuring a size- and cost-optimized power substrate with a multi-function copper layer that interconnects top device pads and serves as external terminals, along with a novel terminal assembly layout that reduces inductance and enhances thermal and electrical coupling, allowing for scalability and modularity to accommodate different power requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If multiple components are packaged in a molded housing with terminal assemblies, then high power handling capability is achieved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent combines multiple terminal assemblies and power devices into a single integrated molded housing, merging separate components into one unified power module. This integration maintains high power handling capability while reducing overall system complexity by consolidating multiple components into a single manufacturable unit.
Solution Approach 2:
The molded housing serves multiple functions simultaneously: it provides mechanical support for power devices, thermal management pathways, electrical isolation between terminals, and structural protection. This multi-functionality reduces the need for separate components, thereby managing complexity while maintaining power handling capabilities.
2Ease of operation
If terminal assemblies extend out of the housing, then ease of connection to external systems is improved, but inductance increases
Solution Approach 1:
The patent optimizes the geometric parameters of terminal assembly connections, using elongated bar configurations with specific contact arrangements that minimize loop area and connection length. This parameter optimization reduces inductance while maintaining ease of external connection.
Solution Approach 2:
The terminal assemblies utilize three-dimensional positioning with contacts extending in multiple directions from the housing, allowing optimized current paths that minimize inductance. The spatial arrangement of contacts in different dimensions enables low-inductance connections while preserving ease of attachment to external systems.
3Power
If vertical power devices are directly coupled between traces and terminal bars, then power handling efficiency is improved, but thermal management challenges increase
Solution Approach 1:
The patent introduces intermediate thermal pathways through the molded housing structure, which acts as a thermal mediator between the vertical power devices and external heat sinks. This intermediary thermal management system enables efficient heat dissipation while maintaining the direct electrical coupling needed for high power handling.
Solution Approach 2:
The molded housing utilizes composite materials with tailored thermal conductivity, combining materials that provide both electrical isolation and thermal conduction pathways. This allows the structure to simultaneously support high power electrical connections while managing thermal dissipation through strategically designed thermal paths.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient power handling and thermal management across a range of power applications, providing a scalable and modular design that maintains performance benefits while accommodating varying power needs without increasing inductance or complexity.
Implementation Method 1
The first plurality of vertical power devices are electrically and mechanically directly coupled between the first trace and a bottom of the first elongated bar of the first terminal assembly
Implementation Method 2
The second plurality of vertical power devices are thermally, electrically, and mechanically directly coupled between the second trace and a bottom of the second elongated bar of the second terminal assembly
Data Source
AI summary
The present disclosure describes a power module having a substrate, first and second pluralities of vertical power devices, and first and second terminal assemblies. The substrate has a top surface with a first trace and a second trace. The first plurality of vertical power devices and the second plurality of vertical power devices are electrically coupled to form part of a power circuit. The first plurality of vertical power devices is electrically and mechanically directly coupled between the first trace and a bottom of a first elongated bar of the first terminal assembly. The second plurality of vertical power devices are electrically and mechanically directly coupled between the second trace and a bottom of a second elongated bar of the second terminal assembly.