Half-Bridge Module Sensor Matrix for Junction Temperature Mapping
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Solution Overview
Problem
Current half-bridge modules in electric vehicles rely on single-point temperature measurement for transistors, leading to inaccuracies in temperature distribution modeling and necessitating costly oversizing to ensure safe operation, which reduces efficiency and increases production costs.
Innovation Solution
A half-bridge module with a temperature sensor matrix comprising multiple sensors thermally connected to transistors, allowing for precise temperature distribution detection within the module, enabling optimized design and operation closer to temperature limits, and potentially reducing the size of the cooling system.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a single temperature sensor is used per half-bridge module, then the device complexity is reduced, but the temperature measurement precision deteriorates
Solution Approach 1:
The temperature monitoring function is segmented from a single-point measurement to a distributed matrix of multiple temperature sensors (e.g., 3x3 grid) placed at different locations on the substrate. Each sensor independently measures temperature at its specific location, transforming one complex measurement task into multiple simpler localized measurements, thereby achieving precise temperature distribution mapping without overwhelming system complexity
Solution Approach 2:
The temperature measurement transitions from a zero-dimensional single-point measurement to a two-dimensional spatial distribution measurement. By arranging sensors in a matrix pattern across the substrate surface, the system captures temperature variations across the entire transistor array area, enabling precise localization of hot spots and accurate thermal modeling
2Device complexity
If temperature sensors are read out individually via shared connection terminals, then the number of connection terminals is reduced, but the reading speed decreases
Solution Approach 1:
Temperature sensors are read out in periodic cycles rather than simultaneously. The system sequentially activates and reads each sensor group through shared connection terminals in alternating time slots. This time-division multiplexing approach allows multiple sensors to share limited connection resources while maintaining acceptable measurement throughput for thermal monitoring applications
Solution Approach 2:
The connection terminal configuration is made dynamic through selective activation. Instead of permanently connecting all sensors to dedicated terminals, the system dynamically enables specific sensor groups based on measurement needs, operational phase, and thermal criticality, optimizing the balance between reading speed and terminal count
3Productivity
If transistors are operated closer to maximum temperature limit, then the efficiency increases, but the reliability deteriorates
Solution Approach 1:
The temperature sensor matrix provides real-time feedback on the actual thermal state of transistor regions. This feedback is fed back to the control system, which adjusts operating parameters (current, voltage, switching frequency) to maintain temperatures within safe margins. The closed-loop control enables operation close to but not exceeding thermal limits, maximizing efficiency while ensuring reliability
Solution Approach 2:
The system incorporates thermal margin cushioning by operating transistors at temperatures below the absolute maximum limit. The temperature sensor matrix detects early temperature rises, and the control system proactively reduces power dissipation before critical thresholds are reached, preventing thermal runaway and ensuring safe operation under varying load conditions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables precise temperature monitoring, reducing the need for costly oversizing, increasing efficiency, and allowing SiC MOSFETs to operate at their maximum temperature, thereby enhancing the range and efficiency of electric vehicles.
Implementation Method 1
the temperature sensors are thermally connected to the transistors at least in some regions
Data Source
AI summary
A half-bridge module having two switching units, each of which includes multiple transistors connected in parallel and/or in series, in particular IGBTs or MOSFETs. The transistors are arranged on a first substrate. The half-bridge module has a temperature sensor matrix having a plurality of temperature sensors, and the temperature sensors are thermally connected to the transistors at least in some regions. A temperature sensor matrix is also provided.