Half Mirror Plating via Selective Masking and Thickness Control

The patent divides the transparent plate surface into multiple regions with different plating thicknesses or plating materials. By segmenting the plating process into different zones (first plating layer in certain regions, second plating layer in other regions), the patent achieves precise control over transmittance in different areas without requiring uniform film thickness control across the entire surface, thereby improving manufacturability.

The patent applies different plating characteristics (thickness, material composition) to different regions of the transparent plate based on local requirements. The first plating layer is applied in regions requiring specific optical properties, while the second plating layer is applied in other regions, allowing each region to have optimized local quality for its intended function, thus avoiding the need for precise global film thickness control.

The patent segments the plating process into multiple stages and regions. Instead of applying a single uniform plating layer across the entire surface, the patent performs plating in different regions sequentially or simultaneously with different parameters, reducing the complexity of controlling film thickness across the whole surface while ensuring reliable coverage in each segment.

The patent applies plating selectively to certain regions rather than uniformly across the entire surface. By performing partial plating actions in specific zones where needed, the patent achieves sufficient coverage for functional requirements without the complexity of controlling film thickness over the complete surface area.