Half-Packaged Flexible Light Strip Co-Extrusion
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing flexible light strips face issues with glue usage affecting light transmittance and causing color shifts, leading to inconsistent lighting effects due to complete coverage with a transparent cover.
Innovation Solution
A half-packaged flexible light strip design where only the surface with light sources is covered by a transparent cover formed through co-extrusion, reducing glue usage and maintaining light consistency, with an accommodating space for heat dissipation and sealed end caps for protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a transparent cover completely covers the flexible printed circuit to isolate the light source, then the life span of the flexible light strip is increased, but much glue is required which affects light transmittance and causes color shift
Solution Approach 1:
The patent divides the packaging into two parts: a transparent cover that only covers the light source area and a flexible printed circuit that remains exposed in other areas. This segmentation reduces the amount of glue required while maintaining protection where needed, thereby improving light transmittance without compromising reliability
Solution Approach 2:
The transparent cover is applied locally only to the area containing the light sources, rather than completely covering the entire flexible printed circuit. This local packaging approach minimizes glue usage in critical areas while maintaining light transmittance in the exposed areas, resolving the contradiction between protection and light quality
2Reliability
If a transparent cover completely covers the flexible printed circuit, then the light source is isolated from the outside, but the glue affects light transmittance and causes color shift
Solution Approach 1:
By segmenting the packaging coverage, the patent isolates the light source in the covered area while leaving the flexible printed circuit exposed, thereby eliminating the harmful color shift effect caused by glue in the exposed areas while maintaining necessary isolation for reliability
Solution Approach 2:
The patent extracts the transparent cover from complete coverage and applies it only to the necessary light source area, removing the harmful glue layer from the exposed flexible printed circuit areas and thereby eliminating color shift while maintaining light source isolation where needed
3Strength
If much glue is used to connect the transparent cover with the flexible printed circuit, then the connection is secure, but the glue affects light transmittance
Solution Approach 1:
The patent segments the packaging area, applying transparent cover and glue only to the light source area where connection strength is needed, while leaving the flexible printed circuit exposed without glue, thereby maintaining connection strength where required while maximizing light transmittance in the exposed areas
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design minimizes color drift and ensures consistent lighting effects by reducing glue usage and providing a heat dissipation space, enhancing the light strip's performance and longevity.
Implementation Method 1
The transparent cover is formed by co-extrusion process and connected to the flexible circuit board
Implementation Method 2
an adhesive coating is coated between the transparent cover and the flexible circuit board
Implementation Method 3
an accommodating space is provided between the transparent cover and the flexible circuit board, and the plurality of light sources is all located in the accommodating space
Data Source
AI summary
A half-enclosed flexible light strip includes a flexible circuit board, a transparent cover with a half-enclosed structure and a plurality of light sources. The plurality of light sources and the transparent cover are all arranged on the same surface of the flexible circuit board. The light sources are located between the transparent cover and the flexible circuit board. The transparent cover is formed by co-extrusion process and connected to the flexible circuit board. The transparent cover with a half-enclosed structure is formed onto the flexible circuit board by co-extrusion process, the use of glue is reduced, so that the light emitted from the two sides of the transparent cover will not cause color drift problem, and this arrangement ensures the consistency of the luminous effect in all directions, thereby improving the light strip use effect.