Hall Element Ball Portion Diagonal Stress Suppression
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Hall elements experience fluctuations in stress due to temperature changes, leading to variations in Hall output voltage, particularly at the contact area where current is concentrated, causing offset voltage fluctuations.
Innovation Solution
A hall element design featuring a substrate with a magnetosensitive portion, an insulating film, conductive portions, and ball portions electrically connected to the conductive portions, where at least one ball portion is positioned on the diagonal of a quadrangle formed by the conductive portions to alleviate stress fluctuations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If current is concentrated on the lower end of the contact, then electrical connection is achieved, but stress fluctuation occurs in the body of the hall element due to temperature changes
Solution Approach 1:
The contact is divided into two distinct parts: a lower end portion that provides electrical connection and an upper end portion that reduces stress concentration. This segmentation allows each part to fulfill its specific function independently, resolving the contradiction between electrical connection and stress fluctuation.
Solution Approach 2:
Different portions of the contact are given different functional qualities: the lower end portion is optimized for electrical connection while the upper end portion is optimized for stress reduction. This local differentiation allows the contact to simultaneously achieve reliable electrical connection and minimize stress fluctuation effects.
2Reliability
If current is concentrated on the lower end of the contact, then electrical connection is achieved, but offset voltage fluctuation occurs in the Hall output
Solution Approach 1:
The contact is segmented into lower and upper end portions, where the lower portion ensures electrical connection and the upper portion minimizes stress-induced offset voltage fluctuations. This segmentation decouples the electrical connection function from the measurement precision function.
Solution Approach 2:
The upper end portion of the contact acts as an intermediary element that mediates between the electrical connection requirement and the measurement precision requirement. It transmits electrical current while simultaneously reducing the transmission of stress fluctuations to the Hall element body.
3Reliability
If mold resin deforms due to temperature changes, then packaging protection is provided, but stress fluctuation occurs in the hall element body
Solution Approach 1:
The contact structure, particularly the upper end portion, serves as an intermediary that absorbs and mitigates stress fluctuations transmitted from the deforming mold resin to the Hall element body. This intermediary structure protects the sensitive Hall element while maintaining the packaging's protective function.
Solution Approach 2:
The contact's geometric parameters are optimized to change its mechanical properties, making it more compliant to temperature-induced deformations. By adjusting the contact's shape and dimensions, it can accommodate mold resin deformation without transmitting excessive stress to the Hall element body.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The ball portions effectively suppress stress fluctuations caused by temperature changes, stabilizing the Hall output voltage and reducing variations in the hall element's output characteristics.
Implementation Method 1
a fluctuation in stress accompanied by a change in temperature environment, and the like is suppressed by a ball portion
Data Source
AI summary
A hall element is provided to suppress fluctuation in a Hall output voltage of the hall element which is generated due to a fluctuation in stress. The hall element may be formed to include a substrate, a magnetosensitive portion formed on the substrate, an insulating film formed on the magnetosensitive portion, four conductive portions (electrode portions and contact portions) which are formed on the insulating film, electrically connected to the magnetosensitive portion through the insulating film, and disposed at positions serving as vertexes of a quadrangle, and ball portions electrically connected to the conductive portions, and at least one ball portion is disposed on a diagonal line of the quadrangle formed by a region surrounded by the four conductive portions and above a portion where the conductive portion and the insulating film are in contact with each other.


