Hall Element Fixation Structure for Vibration Resistance
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Solution Overview
Problem
Existing power conversion apparatuses face challenges in miniaturization and vibration resistance due to the size increase and low strength of lead-type packages with Hall elements, affecting detection accuracy and vibration resistance.
Innovation Solution
An electronic component fixation structure featuring a holding member made of insulating material with protrusion portions that securely engage with a wiring substrate, allowing semiconductor elements with resin-sealed connection terminals to be solder-connected, providing mechanical stability and miniaturization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a lead type package with a Hall element sealed therein is mounted on a substrate, then the Hall element can be protected and electrically connected, but the size of the sensor portion increases due to the insulation distance requirement of exposed lead portions
Solution Approach 1:
The holding member integrates multiple functions into a nested structure: the storing portion houses the main body portion, the protection portion surrounds the connection terminals, and the protrusion portions provide mechanical engagement. This nested configuration eliminates the need for separate lead-type packages and their associated insulation distances, thereby reducing the overall sensor portion size while maintaining electrical insulation and connection reliability.
Solution Approach 2:
The holding member combines the functions of mechanical support, electrical insulation, and terminal protection into a single integrated component. By merging these functions, the design eliminates the need for separate lead structures that would require additional insulation clearance, thus reducing the sensor portion size without compromising reliability.
2Strength
If a lead type package with a Hall element sealed therein is mounted on a substrate, then the Hall element can be protected, but the lead portion connected to the wiring substrate has low strength and insufficient vibration resistance
Solution Approach 1:
The holding member features a planar portion that provides a stable mounting surface on the wiring substrate, and protrusion portions that engage with corresponding structures on the substrate. This geometric design distributes mechanical stress and vibration forces across multiple contact points, significantly enhancing vibration resistance strength compared to traditional lead-type packages with single-point connections.
Solution Approach 2:
The holding member is made of insulating material that combines mechanical strength with electrical insulation properties. This composite structure provides both the structural integrity needed for vibration resistance and the electrical insulation required for safe operation, eliminating the need for separate lead materials and their associated weakness issues.
3Volume of moving object
If miniaturization is pursued for the power conversion apparatus, then the overall size is reduced, but the existing lead-type package structure cannot achieve sufficient vibration resistance
Solution Approach 1:
The nested configuration of the holding member allows the main body portion to be housed within the storing portion while the protection portion surrounds the connection terminals. This space-efficient design achieves miniaturization of the sensor portion while the integrated protrusion portions provide robust mechanical engagement that maintains vibration resistance despite the reduced overall size.
Solution Approach 2:
The planar portion and protrusion portions of the holding member create a stable, multi-point engagement structure with the wiring substrate. This geometric design ensures that even in a miniaturized configuration, the connection can withstand vibration forces by distributing stress across multiple contact areas rather than relying on fragile lead wires.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables reliable fixation of electronic components with improved vibration resistance and miniaturization, enhancing detection accuracy and reducing stress on connection terminals, while facilitating assembly and cost-effective manufacturing.
Implementation Method 1
a Hall element (a magnetism detection element) which detects the density of magnetic fluxes generated in the gap, detects current flowing in response to the density of magnetic fluxes in the Hall element
Implementation Method 2
enclosing a current passing conductor with a core having a gap formed in one circumferential portion thereof
Data Source
AI summary
An electronic component fixation structure disclosed in the present application includes a holding member which, being made of an insulating material, is formed of a storing portion which stores a main body portion of an electronic component, a protection portion which surrounds a plurality of connection terminals of the electronic component, and a pair of protrusion portions which protrude upward from the respective central portions of a pair of side walls of the protection portion; and a wiring substrate on which to connect between electronic components, wherein the pair of protrusion portions of the holding member are engaged with the wiring substrate, and the plurality of connection terminals of the electronic component are solder connected to the wiring substrate.