Hall Element Flush with Resin Surface for Thickness Reduction
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Solution Overview
Problem
There is a need for semiconductor devices with reduced thickness, as existing devices with Hall elements and sealing resins contribute to increased thickness due to the thickness of the sealing resin covering the Hall element.
Innovation Solution
A semiconductor device design where a Hall element with exposed surfaces is covered by a sealing resin with obverse and reverse surfaces, and the exposed surface of the Hall element is made flush with either the obverse or reverse surface of the resin, allowing for thickness reduction through grinding, and the use of conductive bonding materials and terminals with specific configurations to enhance electrical connectivity and mechanical stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a sealing resin covers the Hall element, then the Hall element is protected, but the overall thickness of the device increases
Solution Approach 1:
The patent extracts the sealing resin from completely covering the Hall element. Instead, the resin is applied only to specific regions that require protection, while the exposed surface of the Hall element remains uncovered. This selective extraction of the sealing function reduces the overall device thickness while maintaining necessary protection.
Solution Approach 2:
The patent implements local quality by providing different surface treatments to different regions of the Hall element. The exposed surface is left uncovered for potential electrical connection or sensing purposes, while other surfaces are covered with sealing resin for protection. This localized approach to sealing reduces overall thickness while maintaining protection where needed.
2Length of stationary object
If the exposed surface of the Hall element is made flush with the resin surface, then the device thickness is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The patent applies preliminary action by forming the exposed surface of the Hall element to be substantially flush with the resin surface during the manufacturing process itself, rather than requiring post-manufacturing adjustment. The grinding or planing step is performed on both the Hall element and the resin simultaneously to achieve the flush alignment, preemptively solving the thickness issue.
Solution Approach 2:
The patent merges the sealing resin application with the surface finishing process. By applying the resin and then grinding both the resin and the Hall element together in a combined operation, the process achieves flush surfaces while managing precision requirements through a unified manufacturing step rather than separate operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves a significant reduction in the overall thickness of the semiconductor device while maintaining effective electrical connections and mechanical integrity, enabling more compact and efficient device configurations.
Implementation Method 1
a Hall element can be used as a sensor of various forms due to the Hall effect
Data Source
AI summary
A semiconductor device includes a Hall element, a sealing resin and at least one mount surface. The Hall element includes a functional surface and at least one electrode provided on the functional surface. The sealing resin includes a resin obverse surface and a resin reverse surface spaced apart from each other in a thickness direction, and covers at least a portion of the Hall element. The mount surface is electrically connected to the electrode of the Hall element and exposed from the resin reverse surface. The Hall element includes an exposed surface opposite to the functional surface. The exposed surface is flush with either one of the resin obverse surface and the resin reverse surface.