Hall IC Position Sensor for Air Cylinder Grooves

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Solution Overview

Problem

Conventional position detecting devices for air cylinders face limitations in mountable minimum stroke and hysteresis, with contact-type sensors being too large and non-contact-type sensors occupying excessive space, necessitating a solution that balances size and accuracy.

Innovation Solution

A position detecting device utilizing a Hall IC with a resin covering, positioned perpendicularly to the magnetic pole boundary, which improves sensitivity and reduces size by using a frame to secure the Hall IC within the resin, allowing for precise piston position detection within a smaller groove on the air cylinder.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If a non-contact-type sensor is used to improve measurement precision, then hysteresis is reduced, but the device size increases and it occupies large space

Engineering Contradiction:
ImprovehysteresisVSAvoiddevice size
Core Design Contradiction:
Measurement precisionVSVolume of moving object

Solution Approach 1:

The patent combines the magnetic body and Hall IC into a single integrated position detecting device, eliminating the need for separate mounting of sensor components. This integration achieves both high measurement precision (hysteresis of 0.1mm) and compact size, resolving the contradiction between precision and device volume.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent replaces contact-type mechanical sensing with a non-contact Hall IC-based magnetic field sensing system. This substitution eliminates mechanical hysteresis while maintaining compact dimensions, achieving both low hysteresis (0.1mm) and small device size through electronic rather than mechanical detection.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Measurement precision

If a non-contact-type sensor is used to improve measurement precision, then hysteresis is reduced, but the device complexity increases due to additional mounting components

Engineering Contradiction:
ImprovehysteresisVSAvoidmounting structure
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The magnetic body and Hall IC are integrated into a single unit with unified mounting structure. This merging eliminates the need for separate mounting of sensor components, reducing device complexity while maintaining the low hysteresis (0.1mm) performance of non-contact sensing.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The integrated position detecting device serves multiple functions: the magnetic body provides magnetic field generation/detection, the Hall IC performs position sensing, and the single mounting structure handles both components. This multi-functionality reduces overall device complexity while achieving high measurement precision.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Volume of moving object

If a contact-type sensor is used to reduce device size, then the sensor can be mounted in smaller grooves, but mountable minimum stroke increases and hysteresis worsens

Engineering Contradiction:
Improvedevice sizeVSAvoidmountable minimum stroke
Core Design Contradiction:
Volume of moving objectVSMeasurement precision

Solution Approach 1:

The patent replaces contact-type mechanical sensing with non-contact Hall IC-based magnetic field sensing. This substitution eliminates the mechanical interference that limits mountable minimum stroke in contact sensors, achieving both compact size and improved stroke capability (mountable minimum stroke of 1mm or less).

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the detection principle from mechanical contact to magnetic field sensing, fundamentally altering the operational parameters. This parameter change enables the device to achieve compact dimensions while simultaneously improving mountable minimum stroke and eliminating contact-type hysteresis.

Inventive Principle:
Principle #35Parameter changes

4Volume of moving object

If a contact-type sensor is used to reduce device size, then the sensor can be mounted in smaller grooves, but hysteresis increases

Engineering Contradiction:
Improvedevice sizeVSAvoidhysteresis
Core Design Contradiction:
Volume of moving objectVSMeasurement precision

Solution Approach 1:

The patent replaces contact-type mechanical sensing with non-contact Hall IC-based magnetic field sensing. This substitution eliminates mechanical hysteresis entirely while maintaining compact device size, achieving both small dimensions and low hysteresis (0.1mm) simultaneously.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution achieves a significantly improved mountable minimum stroke of 1 mm and reduced hysteresis of 0.1 mm, surpassing conventional sensors' performance in terms of sensitivity and space efficiency.

Implementation Method 1

Hall IC which switches on/off electrical signal output depending on the relative position to the magnetic body

Methodology Applied
Scientific EffectHall Effect: Hall Effect

Data Source

PatentUS7999538B2Device and system for detecting position
Publication Date: 2011.08.16 ASA ELECTRONICS IND CO LTD
  • US7999538B2 patent drawing
  • US7999538B2 patent drawing
  • US7999538B2 patent drawing

AI summary

To provide a position sensor small enough to be contained in a groove formed in an air cylinder in which minimum stroke for fixing and differential travel are improved [MEANS FOR SOLVING PROBLEMS] The position sensor comprises a Hall IC (50) for turning an electric signal on/off according to the position relative to a magnet provided on the piston of an air cylinder, a resin (60) such as a polyamide resin molded to cover the Hall IC (50), a stainless steel frame (30) defining the orientation and position of the Hall IC (50) in the resin (60), a part (40) fixed to the frame (30) in order to pass a screw for fixing the position sensor (1) to the air cylinder, conductors (18, 20, 22) connected to terminals (24, 26, 28) of the Hall IC (50) by soldering, rubber insulators (12, 14, 16) covering the conductors (18, 20, 22), and a rubber sheath part (10) for bundling the insulators (12, 14, 16).